Rohm Co., Ltd.

Taro Nishioka

Akihiro Koga

Yasumasa Kasuya

Hiroaki Matsubara

Akinori Nii

Bin Zhang

Mamoru Yamagami

Yuto Nishiyama

Tomohira Kikuchi

Yoshizo Osumi

Sadamasa Fujii

Tsunehisa Ono

There is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the lead frame.

Semiconductor device, method of manufacturing semiconductor device, and module

A semiconductor a first device includes semiconductor chip and a second semiconductor chip to which different power-supply voltages are supplied, connection bonding wires connecting the first semiconductor chip and the second semiconductor chip to each other, and a sealing resin provided to fill a gap between a first lead frame on which the first semiconductor chip is mounted and a second lead frame on which the second semiconductor chip is mounted so as to cover the respective circumferences of the first semiconductor chip and the second semiconductor chip. The respective surfaces of the first lead frame and the second lead frame in the regions opposed to each other are covered with an insulating protection film including a material having higher electrical breakdown voltage than a material included in the sealing resin.

Semiconductor device

The present invention provides a sensor module for preventing the corrosion of electrode pads and a method of manufacturing the same. The sensor module Aincludes: an electronic component, having a mounting surfaceand an installation surfacefacing opposite sides, wherein the mounting surfaceis disposed with electrode pads; an atmospheric pressure sensor, having a main surfaceand an installation surfacefacing opposite sides, and a side surfaceconnecting the main surfaceto the installation surface, and mounted on the mounting surfaceof the electronic componentwith the installation surfacefacing the electronic component; a bonding wire, connected to the electrode pads; and a protective member, covering the electrode pads. The protective memberexposes a portion of the bonding wireand is in contact with the side surfaceof the atmospheric pressure sensor

Sensor module and method of making the same

An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

Electronic device and mounting structure of the same

A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

A semiconductor device is provided with a substrate including a main surface and a back surface that face in opposite directions to each other in a thickness direction, and first, second and third direction sensor elements having different detection reference axes from each other. The substrate is formed with a recessed portion that is recessed from the main surface toward the back surface side. The first direction sensor element is disposed at least partially within the recessed portion. The second direction sensor element is disposed so as to overlap with the main surface as viewed in the thickness direction.

Semiconductor device provided with direction sensor elements

The semiconductor device according to the present invention includes a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead arranged around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package collectively sealing the semiconductor chip, the island, the lead and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

Growing community of inventors

Kyoto, Japan

Taro Nishioka