Senju Metal Industry Co., Ltd.

Taro Itoyama

Shunsaku Yoshikawa

Sakie Okada

Naoko Hirai

Hideyuki Komuro

Motoki Koroki

Keitaro Shimizu

A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof and a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.

Solder paste

A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.

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Tokyo, Japan

Taro Itoyama