Seiko Instruments Inc

Taro Ito

Noriyoshi Shoji

Yuji Nakamura

Osamu Takizawa

Norimitsu Sambongi

Yumiko Yamaguchi

A thermal head has a head chip having an upper surface, a lower surface and a side surface. Heating elements are disposed on the upper surface of the head chip, and electrodes are disposed on the upper surface of the head chip and connected to the heating elements. A wiring substrate is disposed on the lower surface of the head chip. A semiconductor integrated circuit is mounted on the wiring substrate and is in contact with the side surface of the head chip and connected to the electrodes.

Thermal head, thermal head unit, and method of manufacture thereof

A thermal head and a thermal head unit are provided, which can prevent density variation while suppressing the size of the thermal head to be small. In a thermal head ( ) having a head chip ( ) having one surface on which heat generating elements and segment and common electrodes connected to the heat generating elements are provided, and an IC chip ( ) connected to the segment electrodes, the common electrode ( ) provided to the head chip ( ) is elongated in an array direction of the heat generating elements, and connections between the common electrode ( ) and common electrode wirings ( ) are provided at plural locations along the array direction.

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Chiba, Japan

Taro Ito