Rohm Co., Ltd.

Taro Hayashi

Isamu Nishimura

Hideaki Yanagida

Hirofumi Takeda

Natsuki Sakamoto

The present invention provides a thermal print head capable of better performing printing on a printing medium; the thermal print head including: a substrate (), formed with single crystal semiconductor; a resistor layer (), including a plurality of heating portions () arranged in a main scan direction; and a wiring layer (), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (), being a surface opposite to the resistor layer; and a convex portion (), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction. Each of the plurality of heating portions includes a heating curving portion () formed on a portion corresponding to the curving surface.

Thermal print head

A semiconductor device includes: a substrate including a main surface; a wiring portion including a first conductive layer formed on the main surface, and a first plating layer which is provided on the first conductive layer and on which an oxide film is formed; a semiconductor element including an element mounting surface and an element electrode formed on the element mounting surface; a bonding portion including a second plating layer made of the same material as the first plating layer and laminated on the first conductive layer, and a solder layer laminated on the second plating layer and bonded to the element electrode; and a sealing resin covering the semiconductor element.

Semiconductor device

Semiconductor device includes: substrate having substrate main surface and substrate rear surface facing opposite sides to each other in first direction, and substrate side surface facing in second direction orthogonal to the first direction; wiring layer having main surface electrode covering a portion of the substrate main surface, and side surface electrode connected to the main surface electrode and covering a portion of the substrate side surface; semiconductor element electrically connected to the main surface electrode and mounted on the substrate to face the substrate main surface; and sealing resin having resin side surface facing in the same direction as the substrate side surface, and covering the semiconductor element and the main surface electrode, wherein the side surface electrode has side exposed surface exposed from the sealing resin and facing in the same direction as the substrate side surface, the side exposed surface being flush with the resin side surface.

Growing community of inventors

Kyoto, Japan

Taro Hayashi