Qualcomm Incorporated

Texas Instruments Corporation

Texas Instruments France

Tarek Zghal

Richard Gerard Hofmann

Bohuslav Rychlik

Christopher E Koob

Andrew Edmund Turner

George Patsilaras

Subbarao Palacharla

Nicolas Chauve

Maxime Leclercq

Fernand Da Fonseca

Zhenbiao Ma

In certain aspects, a method for sending data over a bus comprises: calculating a parity check code for a new data code, wherein the new data code comprises a number of bits in the new data code; calculating a Hamming distance between the new data code and a prior data code; and if the Hamming distance is greater than half of the number of bits in the new data code: inverting the new data code and the parity check code to obtain an inverted new data code and an inverted parity check code; and sending the inverted new data code and the inverted parity check code to the bus.

Bit inversion for data transmission

A system and method for a die-to-die interconnect interface and protocol for stacked semiconductor dies. One preferred embodiment comprises an integrated circuit (IC) package comprising a first semiconductor die that includes an interface to a memory-mapped device, a second semiconductor die that does not include an interface to a memory mapped device, and a data bus coupling the first semiconductor die to the second semiconductor die (the data bus used to transfer a control word and a data word). The control word comprises a data word start address that corresponds to a location in the memory-mapped device. The data word is transferred from the second semiconductor die to the first semiconductor die and is stored by the first semiconductor die at the location in the memory-mapped device. Both semiconductor dies are mounted within the IC package.

Die-to-die interconnect interface and protocol for stacked semiconductor dies

Growing community of inventors

San Diego, CA, United States of America

Tarek Zghal