Huawei Technologies Co., Limited

Taqing Feng

Jian Shi

Yuping Hong

Hui Lin

Zhijian Li

Liqian Zhai

Qiong Wu

Xiaoming Kong

Hongliang Chen

Youlin Jin

Embodiments of the present invention disclose a liquid cooling apparatus, which includes a cold plate (), a fast connector (), and a first interface (), where the fast connector () includes a first connector () and a second connector (), where the first connector () is fixedly connected to the cold plate (); the first interface () is configured to connect to a second interface () corresponding to the first interface; and the liquid cooling apparatus further includes a guide rail (), where the guide rail () is a moving rail of the second connector (), and when the first connector () and the second connector () are in a connected state and the second connector () is located at an end on the guide rail () that is close to a board (), a distance between the first interface () and the second interface () is greater than 0.

Liquid cooling apparatus

A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (). The substrate () having a surface where a heat absorbing surface () is formed. There are multiple hollow conduits inside the substrate () to act as evaporating conduits (). The heat dissipation device further comprises condensing conduits () intercommunicated with the evaporating conduits (). The evaporating conduits () and the condensing conduits () form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits () are set in the substrate ().

Heat dissipation device and radio frequency module with the same

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Shenzhen, China

Taqing Feng