Growing community of inventors

Helsinki, Finland

Tapio Hill

Average Co-Inventor Count = 2.57

ph-index = 6

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 184

Tapio HillKimmo Juhani Mylly (3 patents)Tapio HillMatti Kalevi Floman (3 patents)Tapio HillJani Hyvonen (3 patents)Tapio HillKimmo Kuusilinna (3 patents)Tapio HillJukka-Pekka Vihmalo (3 patents)Tapio HillJari Antero Nikara (2 patents)Tapio HillJani Klint (1 patent)Tapio HillJani Hyvönen (5 patents)Tapio HillJani J Klint (3 patents)Tapio HillMika Kuulusa (2 patents)Tapio HillVesa Lahtinen (2 patents)Tapio HillTommi Makelainen (2 patents)Tapio HillKimmo Kalervo Kuusilinna (1 patent)Tapio HillJani Klint (1 patent)Tapio HillTapio Hill (9 patents)Kimmo Juhani MyllyKimmo Juhani Mylly (64 patents)Matti Kalevi FlomanMatti Kalevi Floman (25 patents)Jani HyvonenJani Hyvonen (23 patents)Kimmo KuusilinnaKimmo Kuusilinna (13 patents)Jukka-Pekka VihmaloJukka-Pekka Vihmalo (7 patents)Jari Antero NikaraJari Antero Nikara (17 patents)Jani KlintJani Klint (9 patents)Jani HyvönenJani Hyvönen (5 patents)Jani J KlintJani J Klint (3 patents)Mika KuulusaMika Kuulusa (3 patents)Vesa LahtinenVesa Lahtinen (2 patents)Tommi MakelainenTommi Makelainen (2 patents)Kimmo Kalervo KuusilinnaKimmo Kalervo Kuusilinna (4 patents)Jani KlintJani Klint (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Nokia Corporation (4 from 8,282 patents)

2. Memory Technologies LLC (3 from 53 patents)

3. Icl Personal Systems Oy (1 from 6 patents)

4. Uniforce Tech Limited Liability Company (1 from 2 patents)


9 patents:

1. 11797180 - Apparatus and method to provide cache move with non-volatile mass memory system

2. 10877665 - Apparatus and method to provide cache move with non-volatile mass memory system

3. 9417998 - Apparatus and method to provide cache move with non-volatile mass memory system

4. RE45029 - Thermal sensors for stacked dies

5. 7894229 - 3D chip arrangement including memory manager

6. 7852138 - Thermal sensors for stacked dies

7. 7477535 - 3D chip arrangement including memory manager

8. 7150012 - Method and apparatus for accelerating program execution in platform-independent virtual machines

9. 5398044 - Method of and an arrangement for controlling the cursor movement on a

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as of
12/27/2025
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