Applied Materials, Inc.

Tapashree Roy

Rutger Meyer Timmerman Thijssen

Robert Jan Visser

Ludovic Godet

Wayne McMillan

Prerna Sonthalia Goradia

Jinxin Fu

Naamah Argaman

Srobona Sen

Tapash Chakraborty

Nitin Deepak

Sage Toko Garrett Doshay

Suraj Rengarajan

Sage Doshay

Riya Dutta

Shubhayan Bhattacharya

Kiran Rangaswamy Aatre

According to certain embodiments, a system for detection of anomalous cells, comprises a hyperspectral imaging system; a memory having executable instructions stored thereon; and a processor configured to execute the executable instructions to cause the system to: receive a patient hyperspectral image comprising a pixel spectral signature for each pixel of the received patient hyperspectral image; classify the patient hyperspectral image by a machine learning model trained to classify hyperspectral images based on pixel spectral signatures; and provide an indication that the patient hyperspectral image contains an anomalous cell type, responsive to the classifying.

Artificial intelligence-based hyperspectrally resolved detection of anomalous cells

Embodiments described herein relate to flat optical devices and encapsulation materials for flat optical devices. One or more embodiments include a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d. The first arrangement of the first plurality of pillars includes a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first adhesion-promoting material is disposed over the first arrangement of the first plurality of pillars. A first encapsulation layer is disposed over the first adhesion-promoting material. The first encapsulation layer fills the gap g between adjacent pillars of the first plurality of pillars. The first encapsulation layer includes a fluoropolymer.

Encapsulation materials for flat optical devices

Embodiments described herein relate to flat optical devices and methods of forming flat optical devices. One embodiment includes a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d, and a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first encapsulation layer is disposed over the first arrangement of the first plurality of pillars. The first encapsulation layer has a refractive index of about 1.0 to about 1.5. The first encapsulation layer, the substrate, and each of the pillars of the first arrangement define a first space therebetween. The first space has a refractive index of about 1.0 to about 1.5.

Air-spaced encapsulated dielectric nanopillars for flat optical devices

Embodiments of metasurfaces having nanostructures with desired geometric profiles and configurations are provided in the present disclosure. In one embodiment, a metasurface includes a nanostructure formed on a substrate, wherein the nanostructure is cuboidal or cylindrical in shape. In another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein each of the nanostructures has a gap greater than 35 nm spaced apart from each other. In yet another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein the nanostructures are fabricated from at least one of TiO, silicon nitride, or amorphous silicon, or GaN or aluminum zinc oxide or any material with refractive index greater than 1.8, and absorption coefficient smaller than 0.001, the substrate is transparent with absorption coefficient smaller than 0.001.

Nanostructures for optical devices

An imaging system and a method of manufacturing a metalens array is provided. The imaging system includes a metalens array, and light scattered from an object is split by the metalens array, such that an image is formed in front of an observer. The metalens array is at least partially transparent to visible light, so that the observer can also see the environment. The method of manufacturing the metalens array includes bonding together a plurality of substrates, and dicing the plurality of substrates into metalens arrays. The metalens arrays can be used in the imaging system.

Imaging system and method of manufacturing a metalens array

Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.

Multi stack optical elements using temporary and permanent bonding

Embodiments described herein relate to nanostructured trans-reflective filters having sub-wavelength dimensions. In one embodiment, the trans-reflective filter includes a film stack that transmits a filtered light within a range of wavelengths and reflects light not within the first range of wavelengths. The film stack includes a first metal film disposed on a substrate having a first thickness, a first dielectric film disposed on the first metal film having a second thickness, a second metal film disposed on the first dielectric film having a third thickness, and a second dielectric film disposed on the second metal film having a fourth thickness.

Non-absorptive trans-reflective nanostructured RGB filters

A method for creating a flat optical structure is disclosed, having steps of providing a substrate, etching at least one nanotrench in the substrate, placing a dielectric material in the at least one nanotrench in the substrate and encapsulating a top of the substrate with a film.

Method for creating a dielectric filled nanostructured silica substrate for flat optical devices

Embodiments of the present disclosure generally relate to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A substrate, such as a silicon wafer, is provided as a base for forming an optical device. A transparent layer is disposed on a first surface of the substrate, and a structure layer is disposed on the transparent surface. An etch mask layer is disposed on a second surface of the substrate opposite the first surface, and a window or opening is formed in the etch mask layer to expose a portion of the second surface of the substrate. A plurality of nanostructures is then formed in the structure layer, and a portion of the substrate extending from the window to the transparent layer is removed. A portion of the transparent layer having nanostructures disposed thereon is then detached from the substrate to form an optical device.

Transferring nanostructures from wafers to transparent substrates

Aspects disclosed herein relate to color filters for display devices, and more specifically to color filters for transmitting or reflecting and recycling colors of light in liquid crystal display devices. In one aspect, a metasurface is formed between two polarizers in an LCD device. In another aspect, a metasurface is formed on a white light guide of an LCD device. The metasurface is formed to transmit desired color(s) of light and to reflect undesired color(s) of light back into the light guide to be recycled and passed through the LCD device elsewhere. Using the color filter to recycle reflected colors of light increases the efficiency of the display device, such as the LCD device.

Growing community of inventors

Bengaluru, India

Tapashree Roy