Global Technology Inc.

Taotao Ye

Qilin Hong

Gaofei Yao

Kejun Chen

Jian-Hong Luo

Dong-Biao Jiang

Jiandong Mao

An optical transceiving device includes a housing including opposite lateral surfaces, a fastening component movably disposed on the housing, and a bail assembly including a carrier, a handle and a securing structure. The fastening component includes a linkage arm and two extending arms connected with the linkage arm. The two extending arms configured to be detachably fastened with a cage. The carrier is fixed to the fastening component. The carrier and the linkage arm jointly define an accommodation space having an opening. The handle is disposed on the carrier and movable along a release direction to be at either a close position or an open position. The handle is held in the accommodation space by the securing structure when at the close position. The handle protrudes from the opening when at the open position, and brings the fastening component to move together.

Optical transceiving device and release mechanism thereof

An optical transceiver includes a housing, an optical communication module and a heat dissipation component. The optical communication module is disposed in the housing. The heat dissipation component is disposed in the housing and in thermal contact with the housing and the optical communication module, and the heat dissipation component is a stamped metal plate.

Optical communication assembly and transceiver with stamped metal for heat dissipation and stamped heat dissipation component thereof

Related to an optical communication module, the optical communication module comprises a main body, an optical communication assembly and a second circuit board. The main body comprises a housing and a first circuit board disposed on the housing. The housing and the first circuit board together form an airtight cavity of the main body, and the first circuit board comprises two first electric interfaces. The optical communication assembly is accommodated in the airtight cavity and comprises a substrate, an optical communication element and a second electric interface. The optical communication element disposed on the substrate. One of the two first electric interfaces of the first circuit board is electrically connected to the second electric interface. The second circuit board comprises a third electric interface and the other one of the two first electric interfaces of the first circuit board is electrically connected to the third electric interface.

Optical communication module with circuit board compatible with hemetical/non-hemetical packaging and optical transceiver having the same

An optical module is disclosed. The disclosed optical module may include a retractable structure having a housing and an upper cover. A clip component for connecting to a chassis is arranged within the housing. A release component for controlling the clip component is arranged on the upper cover. More space within the housing can be available for internal components of the optical module.

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Ningbo, China

Taotao Ye