Utstarcom, Incorporated

Taojin Le

Shanquan Bao

William Huang

Hongqi Wu

Guo Tao Liu

Meng-en Tan

A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The miniaturized form factor card also incorporates an array of solder pads for alternative permanent engagement of a mating array of solder pads on a printed circuit board in an alternative mobile information device. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector or, alternatively, the solder pad array.

Method and apparatus for soldering option of a highly integrated miniaturized form factor card

A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation. A high conductivity membrane is provided on the card case for increased conductivity from the case into the pad on the PCB.

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Hangzhou, China

Taojin Le