Orthodyne Electronics Corporation

University of California

Tao Xu

Christoph Benno Luechinger

Orlando Luis Valentin

Erich Christoph Mueller

Mark Bachman

Guann-Pyng Li

Fan-Gang Zeng

Patrick Coffey

A system for processing a solar substrate is provided. The system includes a support structure for supporting a solar substrate. The system also includes a brushing system for selectively removing an interaction layer from an electrode region of the solar substrate.

Systems and methods for processing solar substrates

A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.

An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.

Ultrasonic bonding systems and methods of using the same

An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.

An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.

An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.

A directionally-sensitive device for detecting and processing vibration waves includes an array of polymeric optical waveguide resonators positioned between a light source, such as an LED array, and a light detector, such as a photodiode array. The resonators which are preferably oriented substantially perpendicularly with respect to incoming vibration waves, vibrate when a wave is detected, thus modulating light signals that are transmitted between the light source and the light detector. The light detector converts the modulated light into electrical signals which, in a preferred embodiment, are used to drive either the speaker of a hearing aid or the electrode array of a cochlear implant. The device is manufactured using a combination of traditional semiconductor processes and polymer microfabrication techniques.

Growing community of inventors

Irvine, CA, United States of America

Tao Xu