Delta Electronics, Inc.

National Chung Shan Institute of Science and Technology

Tao Wang

Zhen-Qing Zhao

Zheng-Fen Wan

Zeng Li

Chien-Te Yu

Kai Lu

Hung-Ting Chou

Hai-Bin Xu

Ching-I Chien

Jun-Cheng Lu

Jianhong Zeng

Yuliang Zhang

Min Zhou

Disclosed herein is a power supply apparatus. The power supply apparatus includes at least one power unit and a magnetic unit. The magnetic unit is stacked with and electrically connected to the at least one power unit. The magnetic unit comprises a plurality of pins and a magnetic core. The at least part of the plurality of pins extends out of a projection of the magnetic core in a connection plane of the at least one power unit and the magnetic unit to connect to the at least one power unit.

Power supply apparatus

A vector modulator includes a quadrature component generator, configured to generate an input in-phase signal and an input quadrature signal according to an input radio frequency (RF) signal; a switching circuit, receiving a plurality of bits, comprising a plurality of switches controlled by the plurality of bits, configured to generate an output in-phase signal and an output quadrature signal according to the plurality of bits, where the output in-phase signal and the output quadrature signal are related to input in-phase signal and the input quadrature signal; and a combining module, configured to generate an output RF signal according to the output in-phase signal and the output quadrature signal.

Digital-controlled vector signal modulator

The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.

Power module

A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.

Power module packaging structure and method for manufacturing the same

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Taoyuan, Taiwan

Tao Wang