Bridgelux Incorporated

Luminus, Inc.

Auditoria.ai, Inc.

Signify Holding B.v.

Tao Tong

R Scott West

Mike Kwon

Wenhui Zhang

Michael Solomensky

Zhengqing Gan

Scott H West

Babak Imangholi

Qifeng Shan

Gerry Keller

Hongtao Ma

Rohit Gupta

Adina Florina Simu

Jinhui Zhai

Abdul Salam Assaad

Sateesh Valluru

Saijin Liu

Kai Liu

Daniel Than

Systems and methods for unifying business records data from different database sources into a common format in the same repository are disclosed. In one embodiment, a process includes receiving, by an integration platform system, a first set of business records data from a customer records system, where the business records data includes records in a first format, identifying a first transformation rule corresponding to the first format using the integration platform system, where the first transformation rule includes information for converting data from the first format to a unified format, converting each record in the first set of business records from the first format to the unified format by the integration platform system using the first transformation rule, and storing the first set of converted records in the unified format in a business records database.

Systems and methods for unifying formats and adaptively automating processing of business records data

Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration

Methods and apparatus are provided for LED packages with surface textures. In one novel aspect, microstructures are formed on surfaces of the LED package such that light extract efficiency is improved. In one embodiment, the LED package has a silicone-encapsulating layer scattered with phosphors. In another embodiment, the LED package has a leadframe substrate. The microstructure can be micro lens, micro dents, micro pillars, micro cones, or other shapes. The microstructures can be periodically arranged or randomly arranged. In one novel aspect, the compression molding process is used to form rough surfaces. The molding block or the release film is modified with microstructures. In another novel aspect, sandblasting process is used. In one embodiment, microstructures are formed on sidewalls using the sandblasting process. The hardness, the angle, and/or the size of the blasting media are selected to improve the efficiency of the LED package.

LED package with surface textures and methods of formation

A lighting device capable of generating warm or neutral white light using blue light-emitting diodes ('LEDs'), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures ('SLSs'), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature.

Method and apparatus for providing a passive color control scheme using blue and red emitters

A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies.

Substrate free LED package

Devices and methods including an LED and reflective die attach material are described herein. The devices can include a reflective substrate (e.g., a substrate that includes a silver layer) to which one or more LED die are attached using the die attach material. The die attach material extends beyond the periphery of the LED die to cover an area of the substrate surface.

Devices and methods including an LED and reflective die attach material

A packaged UV-LED device comprises a die carrier member having a cup-shaped recess, a fused silica lens member that is anodic bonded to the die carrier member, and a UV-LED die that is flip-chip mounted within a sealed cavity formed by the carrier member and the lens member. The carrier member involves a unitary cup member fashioned in an economical way from monocrystalline silicon wafer material. A dielectric/aluminum reflector that is effective for UV radiation and that does not degrade and overheat is disposed on the sidewalls of the recess. The lens member is anodic bonded to a silicon surface of the rim of this unitary cup member at a time when the UV-LED die is disposed in the recess. The anodic bonding is done in such way that the die is not damaged and such that the entire packaged UV-LED device includes no UV-degradable adhesive.

Packaged UV-LED device with anodic bonded silica lens and no UV-degradable adhesive

Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

An LED assembly includes two strings of surface mounted LED devices mounted to a central ceramic plug portion of a PCB substrate. One string has a CCT of 4000 degrees Kelvin. The other has a CCT of 1800 degrees Kelvin. For each LED device in one string there is a corresponding LED device in the other string. The LED devices of each pair are closely spaced with 0.2-0.6 mm between them. A Highly Reflective (HR) layer is disposed on the substrate between the LED devices. The HR layer has a thickness in a range of from 20 to 50 percent H, where H is the height of an LED die. A transparent silicone layer covers the LED devices. A resistor of a warm-dimming circuit is mounted over the ceramic portion of the substrate whereas an integrated circuit portion of the circuit is mounted over the PCB portion of the substrate.

Color tunable LED assembly

Methods and apparatus are provided to improve long-term reliability of LED packages using reflective opaque die attach (DA) material. In one novel aspect, a protected area surrounding edges of the LED is determined. The DA is applied to the determined protected area by a dispense process, a stamping process, or a screen printing process, such that the effect of temperature degradation is reduced. A heat distribution model is used to determine the protected area, which is between edges of the LED and a predefined isothermal line where the temperature is 1/e that of the temperature at edges of the LED. In another embodiment, the protected area is further based on a spreading ratio of the substrate size to the LED size. In another novel aspect, with multiple LEDs in the LED package, the spreading ratio is further based on pitch distances to the immediate adjacent LEDs and the substrate boundary.

Growing community of inventors

Fremont, CA, United States of America

Tao Tong