Shenyang Kingsemi Co., Ltd.

Tao Miao

Hao Wang

Tianyao Wu

Xinglong Chen

The present invention provides a wafer transfer device. The wafer transfer device comprises a first supporting mechanism and a second supporting mechanisms, wherein the first supporting mechanism and the second supporting mechanism are arranged side by side along a translation direction, and two opposite outer side walls of the first supporting mechanism and the second supporting mechanism are each provided with a picking-conveying guide structure arranged along a telescopic direction perpendicular to the translation direction; a first picking-conveying mechanism and a second picking-conveying mechanism which are movably arranged at the picking-conveying structure of the first supporting mechanism and the picking-conveying guide structure of the second supporting mechanism respectively, wherein each of the first picking-conveying guide structure and the second picking-conveying guide structure comprises a tail end execution part, and the tail end execution part of the first picking-conveying mechanism and the tail end execution part of the second picking-conveying mechanism are oppositely arranged along a lifting direction and face opposite directions, thus transferring a plurality of wafers in two directions. The present invention further provides a wafer transfer method.

Wafer transfer device and wafer transfer method

The wafer transfer device includes a first supporting mechanism, a second supporting mechanism, a first picking-conveying mechanism and a second picking-conveying mechanism, wherein the first picking-conveying mechanism and the second picking-conveying mechanism include tail end execution parts facing opposite directions. The wafer transfer device further includes a rotating mechanism and a rotating driving part, wherein the first supporting mechanism and the second supporting mechanism are fixedly arranged at the rotating mechanism, and the rotating driving part drives the rotating mechanism to rotate and then drives the first supporting mechanism and the second supporting mechanism to rotate synchronously. The wafer transfer device can extend the picking and conveying range of a wafer, thus facilitating the improvement of the productivity.

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Shenyang, China

Tao Miao