Intel Corporation

Tao Liu

Aaron Steyskal

Steve Schiveley

Peir Chu

Mike Greenwood

Tejinder Pal S Aulakh

Jeffory L Smalley

Mani Prakash

Susan F Smith

Harvey R Kofstad

Henry C Bosak

Almanzo T Ortiz

Michael Greenwood

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Multi-chip self adjusting cooling solution

A holding member and system including a first and a second holding member, wherein each of the first holding member and the second holding member are coupled to opposite sides of a load plate of a socket. A holding member includes a body including a pair of arms extending from a first side of the body and spaced to accommodate a portion of an integrated circuit chip package therebetween and at least one clip extending from a second side opposite the first side. Also, a method including coupling an integrated circuit chip package to a first holding member and a second holding member, wherein the first holding member is coupled to a first side of a load plate of a socket and the second holding member is coupled to a second side of the load plate; and inserting the package into a socket of a printed circuit board.

Integrated package insertion and loading mechanism (iPILM)

A holding member and system including a first holding member and a second holding member, wherein each of the first holding member and the second holding member are coupled to opposite sides of a load plate of a socket. A holding member includes a body including a pair of arms extending from a first side of the body and spaced to accommodate a portion of an integrated circuit chip package therebetween and at least one clip extending from a second side opposite the first side. Also, a method including coupling an integrated circuit chip package to a first holding member and a second holding member, wherein the first holding member is coupled to a first side of a load plate of a socket and the second holding member is coupled to a second side of the load plate; and inserting the package into a socket of a printed circuit board.

A wound capacitor has a lead configuration that enables enhanced control over equivalent series resistance (ESR) and equivalent series inductance (ESL). The capacitor has a case and a wound foil disposed within the case. A ball-and-lead configuration is coupled to the foil and extends from the case.

Method for making a wound capacitor

Wound capacitor

A user-selectable integrated circuit capacitance apparatus may include first and second electrodes defining a first fractal geometry, along with second and third electrodes defining a second fractal geometry. A dielectric may be located adjacent to the first and third electrodes. A method of fabricating the apparatus may include selecting a dielectric layer, forming the first and second electrodes so as to define the first fractal geometry on the dielectric layer, and then forming third and fourth electrodes so as to define a second fractal geometry on the dielectric layer. A circuit package may include external package connections connected to the electrodes of the apparatus. A system may include the apparatus coupled to a wireless transceiver by way of a power supply trace.

Selectable capacitance apparatus and methods

A method of fabricating a capacitor provides for coupling a ball grid array (BGA) lead configuration to a foil and disposing the foil within a case. The BGA lead configuration extends from the case.

Method of fabricating a wound capacitor

A capacitor having a plurality of layers with at least one layer including a plurality of electrodes is described. In an embodiment, the electrodes are elongate. The plurality of electrodes includes a plurality of first polarity electrodes and a plurality of second polarity electrodes. In an embodiment, pairs of electrodes are formed by twisting one first polarity electrode and one second polarity electrode together. In an embodiment, first polarity electrodes and second polarity electrodes are woven together in each layer.

Multiple electrode capacitor

The present invention provides a capacitor having a plurality of layers of aluminum foil connected to a first electrical terminal of the capacitor and another plurality of layers of aluminum foil connected to a second electrical terminal of the capacitor. The layers of aluminum foil are separated by a polymer such as a conductive organic polymer, so that each layer of polymer physically separates a layer of aluminum foil connected to the first terminal from a layer of aluminum foil connected to the second terminal. In some such embodiments the aluminum foil may be etched to provide greater surface area and capacitance, and also may be oxidized to form a dielectric layer.

Layered polymer on aluminum stacked capacitor

A termination assembly for a capacitor provides controlled ESR and ESL. First and second termination elements are attached to first and second foils to provide terminal connections. The first and second foils are wound into a cylinder such that the first and second termination elements form a shape within the cylinder and are spaced apart by a first distance. First and second leads are extending from the termination elements, respectively, such that the first and second leads are spaced apart by a second distance different from the first distance.

Efficient termination for wound capacitors

A wound capacitor has a lead configuration that enables enhanced control over equivalent series resistance (ESR) and equivalent series inductance (ESL). The capacitor has a case and a wound foil disposed within the case. A ball grid array (BGA) lead configuration is coupled to the foil and extends from the case.

Multiple terminal SMT BGA-style wound capacitor

A dielectric hybrid material and a dielectric hybrid capacitor.

Growing community of inventors

University Place, WA, United States of America

Tao Liu