Applied Materials, Inc.

Lumentum Operations LLC

Tao Li

Allen L D'Ambra

Roy C Nangoy

Siu Kwan Cheung

Yevgeniy Rabinovich

Lucas Morales

Raman Srinivasan

Sean Burns

David Z Chen

Yuanzhen Zhuang

Tian Shi

A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.

Wafer prober to facilitate testing of a wafer using nanosecond pulses

A method for controlling liquid delivery in a processing chamber. The method includes generating an analog input (AI) signal proportional to a process variable and calculating an analog output (AO) signal based on a setpoint and a deadband. The setpoint is a target value of the process variable and the deadband is an allowable tolerance around the setpoint that determines when the control logic is activated to control the process variable. The method further includes transmitting the AO signal to a control device and adjusting the process variable proportional to the value of the AO signal.

Closed loop control on liquid delivery system ECP slim cell

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Fremont, CA, United States of America

Tao Li