General Electric Company

Harvard College

Other

Huawei Technologies Co., Limited

University of California

Abaco Systems, Inc.

Tao Deng

George M Whitesides

Hendrik Pieter Jacobus De Bock

Stanton Earl Weaver, Jr

Shakti Singh Chauhan

Graham Charles Kirk

Rustem F Ismagilov

Peidong Yang

Galen D Stucky

Paul J A Kenis

Bradley F Chmelka

David J Pine

Francisco Arias

Pingyun Feng

Dongyaun Zhao

Kripa K Varanasi

Yuk-Chiu Lau

Pazhayannur Ramanathan Subramanian

Margaret Louise Blohm

Nitin Bhate

Binoy Milan Shah

Jay Todd Labhart

Pramod Chamarthy

Ming Feng Hsu

Xiaobo Wu

Wayne Charles Hasz

Weiwei Chong

Todd Garrett Wetzel

Ernst Wolfgang Stautner

Yogen Vishwas Utturkar

Dennis Michael Gray

Longzhi Jiang

Kathleen Melanie Amm

Yuri Lvovsky

Dalong Zhong

William Louis Einziger

Tao Zhang

William Joseph McGann

Gregory Allen O'Neil

David Shannon Slaton

Joo Han Kim

Wenwu Zhang

Jalal Hunain Zia

Gregory Citver

Yuan-Hsiang Lee

Todd Charles Curtis

Amy Linsebigler Smentkowski

Christopher Michael Eastman

Stuart Connolly

Brian Patrick Hoden

Zeshan Jabar Hussain

Kenneth Ribeiro

Boris Alexander Russ

Wen Shang

Pramod Charmarthy

Yanglin Ye

Jr Stanton Earl Weaver

A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.

Integrated heat exchange assembly and an associated method thereof

The present invention discloses a single radio voice call continuity handover method and apparatus. An MME records whether a bearer deletion request message sent by a gateway device is received, and if the MME determines that the bearer deletion request message is received, the MME does not send a bearer deletion instruction message to the gateway device, and does not delete a local voice service bearer resource. Therefore, after the MME performs voice service bearer deletion on an IMS side, the MME does not perform voice service bearer deletion on an EPS side, thereby avoiding a conflict in an SRVCC process. Alternatively, when a reason for session termination is SRVCC handover, a PCRF does not send a re-authentication request message to the gateway device, that is, the gateway device does not perform a voice bearer deletion process on the IMS side, thereby avoiding a conflict in an SRVCC process.

Voice service handover method and apparatus in single radio voice call continuity

A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

Reusable phase-change thermal interface structures

A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Flexible metallic heat connector

An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.

Electronics chassis and method of fabricating the same

A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.

Heat exchange assembly and methods of assembling same

An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.

Heat exchange assembly for use with electrical devices and methods of assembling an electrical device

A cryogenic cooling system includes a chamber defined by an outer wall and an inner wall, the chamber housing at least one component to be cooled; a wicking structure in thermal contact with one of the outer wall and the inner wall of the chamber; and a delivery system in a spaced apart relationship with the chamber and fluidly connected to the wicking structure for transporting a working fluid to and from the wicking structure. Also provided is a magnetic resonance imaging system including the cryogenic cooling system.

Cryogenic cooling system with wicking structure

A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described.

Locking device and method for making the same

The present invention provides methods for manufacturing an article having a wetting-resistant surface. The method includes providing a substrate. The method further includes disposing a coating mixture on a surface of the substrate, wherein the coating mixture comprises a braze material and a texture-providing material. The method further includes heating the braze material to bond the texture-providing material to the surface of the substrate to form the article having the wetting-resistant surface.

Methods of preparing wetting-resistant surfaces and articles incorporating the same

The present invention provides methods for manufacturing an article having a wetting-resistant surface. The method includes providing a mixture comprising a plurality of micron-sized first particles and a plurality of nano-sized second particles, and a binder; depositing the mixture onto a substrate to form a wetting-resistant surface via a thermal spray process. The mixture is deposited without substantial melting of the first and second particles. The wetting-resistant surface has wettability sufficient to generate, with a reference fluid, a static contact angle of greater than about 90 degrees.

Method of preparing wetting-resistant surfaces and articles incorporating the same

A method of forming microstructures. An article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental metal. Additional conductive material may then be deposited onto the elemental metal to produce a microstructure.

Fabrication of metallic microstructures via exposure of photosensitive compostion

Fabrication of metallic microstructures via exposure of photosensitive composition

Disclosed herein is a method for making a nanoparticle film comprising dispersing nanoparticles in a first liquid; adding a second liquid to the first liquid to form a nanoparticle film on top of a solution comprising the first liquid, the second liquid and the nanoparticles, wherein the second liquid has a dielectric constant that is different from a dielectric constant of the first liquid; and contacting a substrate with the solution to deposit the nanoparticle film onto the contacted portion of the substrate. Disclosed herein too is a method for detecting an analyte comprising dispersing nanoparticles in a first liquid; adding a second liquid to the first liquid to form a nanoparticle film on top of a solution comprising the first liquid, the second liquid and the nanoparticles, wherein the second liquid has a dielectric constant that is different from a dielectric constant of the first liquid; contacting a substrate with the solution to deposit the nanoparticle film onto the substrate; disposing upon the nanoparticle film an analyte; and performing surface enhanced Raman spectroscopy to determine the identity of the analyte.

Method for forming nanoparticle films and application thereof

A cargo inspection apparatus for the inspection of an analyte carried by a medium is disclosed. The apparatus includes a housing having an inlet allowing for entry of the medium and an outlet allowing for exit of the medium, and an adsorber disposed within the housing in fluid communication with the medium flow from the inlet to the outlet, the adsorber includes a substrate having disposed thereon a nanoparticle film. The nanoparticle film has nanoparticles having an average particle size of equal to or less than about 500 nanometers.

Cargo inspection apparatus having a nanoparticle film and method of use thereof

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Clifton Park, NY, United States of America

Tao Deng