X Display Company Technology Limited

X-Celeprint Limited

Tanya Yvette Moore

Ronald S Cok

Christopher Andrew Bower

Matthew Alexander Meitl

David Julian Gomez

Salvatore Bonafede

Brook David Raymond

Carl Ray Prevatte, Jr

António José Marques Trindade

Erich Radauscher

A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.

Micro-transfer printing stamps and components

A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.

Multi-layer stamp

A stamp for micro-transfer printing comprises a rigid support having a support coefficient of thermal expansion (support CTE). Pedestals are disposed on (e.g., directly on and in contact with) the rigid support. Each of the pedestals is spatially separated from any other of the pedestals. The pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE. Posts are disposed on (e.g., directly on and in contact with) each of the pedestals. Each post has a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.

Transfer stamps with multiple separate pedestals

An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.

Structures and methods for electrical connection of micro-devices and substrates

An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.

High-precision printed structures

A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

Growing community of inventors

Hurdle Mills, NC, United States of America

Tanya Yvette Moore