Ak Optics Technology Co., Ltd.

Tang Zhang

Jianpeng Liu

Chengmin Li

Dong Yan

Linzi Wang

Hongda Jiao

Xiaochao Ma

A self-calibration apparatus and method for a real-time temperature measurement system of a MOCVD device belong to the technical field of semiconductor manufacturing. The apparatus comprises a MOCVD reactor chamber () and an optical detector (). The MOCVD reactor chamber () comprises an epitaxial wafer (). A detection window () is provided on the top of the MOCVD reactor chamber (). The optical detector () emits detection light beams whose wavelengths are respectively &#x3bb;and &#x3bb;toward the epitaxial wafer () through the detection window (). The detection light beams are reflected by the epitaxial wafer () to form reflected light beams which are detected by the optical detector (). In the method, points corresponding to the actual thermal radiation ratios are depicted on the theoretical thermal radiation ratio-temperature curve according to actual thermal radiation ratios, and values of the temperatures T corresponding to the points are substituted into formulas to obtain mand mrespectively. With the method and apparatus, self-calibration of the real-time temperature measurement system of a MOCVD device is realized, thus ensuring consistent and accurate measurements of a growth temperature of the epitaxial wafer.

Self-calibration apparatus and method for real-time temperature measurement system of MOCVD device

A device for detecting a two-dimensional morphology of a wafer substrate in real time. The device comprises: a first calculation module, a second calculation module and an analysis module, wherein the first calculation module calculates the curvature Cbetween any two points of incidence on the wafer substrate in an X direction of a substrate to be detected according to position signals of N light spots; the second calculation module calculates the curvature Cat any one point of incidence on the wafer substrate in a moving direction, i.e. a Y direction, of the substrate to be detected according to the position signals of N light spots. The device can be adapted to a sapphire substrate on a graphite disc which rotates at a high speed.

Apparatus for automatically and quickly detecting two-dimensional morphology for wafer substrate in real time

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Beijing, China

Tang Zhang