Apple Inc.

Other

Tang Yew Tan

David A Pakula

Richard Hung Minh Dinh

Richard P Howarth

Scott A Myers

Jonathan P Ive

Christopher J Stringer

Daniele De Iuliis

Rico L Zorkendorfer

Duncan Robert Kerr

Bartley K Andre

Eugene Antony Whang

Peter N Russell-Clarke

Martha Evans Hankey

Jody R Akana

Jeremy D Bataillou

Erik L Wang

Julian Hoenig

Shota Aoyagi

Mikael M Silvanto

Stephen Paul Zadesky

Daniel William Jarvis

Phillip Michael Hobson

Daniel J Coster

Matthew Dean Rohrbach

Benjamin Andrew Shaffer

Anthony Michael Ashcroft

Molly J Anderson

Markus Peter Diebel

Clement Tissandier

Julian Jaede

Marine C Bataille

Joe Sung Ho Tan

Ian A Spraggs

Charles B Woodhull

Robert W Schlub

Robert J Hill

Shin Nishibori

Adam Duckworth Mittleman

Kenneth Arthur Jenks

Steve P Jobs

Lee E Hooton

Matthew Theobald

Benjamin J Pope

Marwan Rammah

Matthew D Hill

Mattia Pascolini

Stephen Brian Lynch

Michael Benjamin Wittenberg

Jason S Sloey

Trent Weber

Nanbo Jin

Ashutosh Yugesh Shukla

Jared Mitchell Kole

Douglas B Satzger

Calvin Q Seid

Sung Hoon Kim

Robert Sean Murphy

Steven Porter Hotelling

Sawyer Isaac Cohen

Lucy Elizabeth Browning

Pinida Jan Moolsintong

Erik G De Jong

John Patrick Ternus

Brian Richards Land

Donald Joseph Novotney

Bradley Joseph Hamel

Shayan Malek

Scott P Porter

Douglas Lea Heirich

John Benjamin Filson

Emery Artemus Sanford

Brian Quentin Huppi

Douglas Joseph Weber

Peter W Richards

Storrs Townsend Hoen

Michael M Lee

Jonah Alexander Harley

Martin Paul Grunthaner

Omar Sze Leung

Timothy Michael Johnson

Steven James Martisauskas

John B Ardisana, Ii

Ruchir M Dave

Dhaval N Shah

Edward S Huo

M Evans Hankey

Christopher D Prest

Steve Porter Hotelling

Tyler S Bushnell

Dale N Memering

Rico Zörkendörfer

Christopher S Graham

Christopher R Wilk

Jayesh Nath

Hung A Pham

Carlo Di Nallo

Michael Kane Pilliod

John C DiFonzo

Andrew Lewis Johnston

This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Handheld device enclosure with an internal platform

An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

Insert molding around glass members for portable electronic devices

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Components of an electronic device and methods for their assembly

Housing plate

Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.

Offset control for assembling an electronic device housing

This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

Cosmetic co-removal of material for electronic device surfaces

Housing module for an electronic device

A cold worked stainless steel bezel for a portable electronic device is provided. The bezel is secured flush to a housing to form part of the case of the portable electronic device. A brace that includes a slot for receiving a wall extending from the bezel is fixed to the housing. When the bezel engages the housing, the wall of the bezel is inserted in the slot of the brace and releasably held by a spring that engages both the brace and the wall. The bezel can be released by disengaging the spring, (e.g., using a special tool or a magnetic field). Because the bezel is manufactured from cold worked stainless steel, it is hard and resistant to impacts. Cold worked steel also facilitates manufacturing within design constraints and tolerances, and requires very little machining after manufacturing to comply with those constraints.

Cold worked metal housing for a portable electronic device

This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

High tolerance connection between elements

A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.

Force determination based on capacitive sensing

Growing community of inventors

San Francisco, CA, United States of America

Tang Yew Tan