Taiwan Semiconductor Manufacturing Comp. Ltd.

Tang-Hsuan Chung

Huan Chi Tseng

Szu-Chia Huang

Jhih Jie Shao

Huai-Ying Huang

Chien-Chang Lee

Shau-Wei Lu

Jordan Hsu

Jhih-Jie Shao

Yu-Lan Hsiao

The present disclosure provides methods for testing and evaluating electrical parameters of electronic circuits. An exemplary method includes providing a device-under-test electrically coupled to a testing apparatus; and determining an optimum value of a first electrical parameter and an optimum value of a second parameter by testing the device-under-test according to a set of first electrical parameter values and a set of second electrical parameter values. The optimum value of the first electrical parameter and the optimum value of the second parameter are determined based on an electrical noise response of the device-under-test.

Method and apparatus for testing a semiconductor device

A Static Random Access Memory (SRAM) Cell includes a first gate electrode layer covering a channel region of a read pull-down transistor, a second gate electrode layer covering channel regions of a first pull-down transistor and a first pull-up transistor, a third gate electrode layer covering a channel region of a second pass-gate transistor, a fourth gate electrode layer covering a channel region of a read pass-gate transistor, a fifth gate electrode layer covering a channel region of a first pass-gate transistor, and a sixth gate electrode layer covering channel regions of a second pull-down transistor and a second pull-up transistor. The first and second gate electrode layers are separated from each other by a first dielectric layer interposed therebetween, and are electrically connected to each other by a first interconnection layer formed thereon.

Static random access memory

The present disclosure provides a method for testing a semiconductor device. The method includes providing a test unit and an electronic circuit that is electrically coupled to the test unit. The method includes performing a multi-dimensional sweeping process. The multi-dimensional sweeping process includes sweeping a plurality of different electrical parameters across their respective ranges. The method includes monitoring a performance of the electronic circuit during the multi-dimensional sweeping process. The monitoring includes identifying optimum values of the different electrical parameters that yield a satisfactory performance of the electronic circuit. The method includes testing the test unit using the optimum values of the different electrical parameters.

Provided is an apparatus for testing a semiconductor device. The apparatus includes a plurality of testing pads. The apparatus includes a plurality of testing units. The apparatus includes a switching circuit coupled between the testing pads and the testing units. The switching circuit contains a plurality of switching devices. The apparatus includes a control circuit coupled to the switching circuit. The control circuit is operable to establish electrical coupling between a selected testing unit and one or more of the testing pads by selectively activating a subset of the switching devices.

The present disclosure provides a method for testing a semiconductor device. The method includes providing a testing unit and an electronic circuit coupled to the testing unit and applying a first electrical signal to the testing unit. The method includes sweeping a second electrical signal across a range of values, the second electrical signal supplying power to the electronic circuit, wherein the sweeping is performed while a value of the first electrical signal remains the same. The method includes measuring a third electrical signal during the sweeping, the measured third electrical signal having a range of values that each correspond to one of the values of the second electrical signal. The method includes adopting an optimum value of the second electrical signal that yields a minimum value of the third electrical signal. The method includes testing the testing unit while the second electrical signal is set to the optimum value.

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Kaohsiung, Taiwan

Tang-Hsuan Chung