Microcosm Technology Co., Ltd

Parlux Optoelectronics Co., Ltd.

Tang-Chieh Huang

Bo-Hung Lai

Chih-Te Yen

Kunhan Hsieh

Ching-Hao Chang

Yu-Chiao Shih

Sih-Ci Jheng

Chin-Te Yen

Po-Cheng Chen

Yu-Tang Yen

Bing-You Weng

Sunao Hsu

Wei-Ming Hou

Yao-Wen Liu

The invention provides a curable composition for inkjet, a cured product, and a flexible printed circuit board. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet has excellent flexibility, and has a withstand voltage of greater than 2 kV even when the thickness is less than 20 μm.

Curable composition for inkjet, cured product and flexible printed circuit board

The present invention provides a laminate with good adhesion, which includes a transparent substrate, an adhesive layer formed by an adhesive composition, and a metal layer. The adhesive composition contains a resin, an adhesion promoter selected from a triazole compound represented by formula (1), a thiadiazole compound represented by formula (2), a benzotriazole compound represented by formula (3) or a phosphate oligomer; and an antioxidant, in which R˜Rare as defined herein.

Laminate and preparing method thereof

A flexible display cover substrate is provided, including a transparent polyimide film and a device protective layer. The device protective layer is formed by a hard coating layer disposed on at least one side of the transparent polyimide film, and the hard coating layer is composed of three or more reactive functional group compounds, an initiator, an elastic oligomer, a nano inorganic modified particle, and a fluorescent pigment. The flexible display cover substrate of the invention, after being folded by a radius of curvature of 1 mm, does not cause cracks on the surface of the hard coating layer or break the substrate, and the yellow index YI of the flexible display cover substrate is less than 2.0.

Flexible display cover substrate

A polyimide film and a flexible display device cover substrate using the same are provided, and the polyimide film includes a polyimide and a blue infrared absorbing agent. The blue infrared absorbing agent includes cesium tungsten oxide, tungsten oxide, Prussian blue, or antimony tin oxide. The blue infrared absorbing agent has infrared absorbing and photothermal conversion effects, and the surface temperature of the polyimide resin may be increased by infrared irradiation, so as to shorten the baking time.

Polyimide film and flexible display device cover substrate using the same

The present invention relates to an adhesive composition, which comprises an epoxy resin; and a polyimide comprising a repeating unit. The repeating unit comprises a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2): wherein X, Y, Z, m, and n are as defined herein, the weight ratio of polyimide to the total amount of the epoxy resin is 50% to 100%, and in the epoxy resin, the proportion of the epoxy resin having a weight average molecular weight of less than 400 Da accounts for 12 to 40% by weight of the total amount of the epoxy resin. The adhesive formed by the adhesive composition of the present invention has a relatively high glass transition temperature.

Adhesive composition, adhesive comprising the same, and cured product thereof

A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 &#x3bc;m. The silica solution comprises silica particles polymerized by a sol-gel process, and the silica particles have a particle size between 10 nm and 15 nm and account for 5 to 30% of the total weight of the solid composition of the thermally conductive type photosensitive resin.

Thermally conductive type polyimide substrate

A photosensitive and via-forming circuit board comprising a laminate unit, a conductor unit, and a cover layer unit is provided. The laminate unit includes an insulating layer, a first conductive wiring layer and a second conductive wiring layer formed at two opposite sides of the insulating layer, respectively, and at least one through-hole surface defining a through hole extending from the upper surface of the first conductive wiring layer through the insulating layer to the lower surface of the second conductive wiring layer. The conductor unit is formed on the at least one through-hole surface. The cover layer unit is formed from a photosensitive composition comprising an epoxy group-containing compound and a photosensitive polyimide capable of reacting with the epoxy group of the epoxy group-containing compound, and includes a first cover layer formed on the first conductive wiring layer and extending into and filling the through hole.

Photosensitive and via-forming circuit board

The present invention provides a thinned flexible polyimide substrate and a method for manufacturing the same. The thinned flexible polyimide substrate comprises a polyimide resin, a conductor layer, and a polyimide insulating layer. The polyimide resin has a linear thermal expansion coefficient of less than 40 ppm/K. The conductor layer is formed of a plurality of stacked metal nanoparticles having pores therebetween, and each of the pores has a size between 0.1 &#x3bc;m and 1 &#x3bc;m. A portion of the polyimide resin fills into the pores. The polyimide insulating layer is formed of the polyimide resin coated on the conductor layer.

Thinned flexible polyimide substrate and method for manufacturing the same

A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): 

Photosensitive polyimide resin composition and method of manufacturing cover film using the same

A transparent and colorless polyimide resin is provided. The polyimide resin is derived from at least two dianhydride monomers and at least two diamine monomers. At least one monomer in the dianhydride and diamine monomers includes structure of formula (1). The monomer with structure of formula (1) has an amount of moles accounting for 10-50% of total moles of the dianhydride or diamine monomers.  In formula (1), X is SO,C(CH)or C(CF), Y is oxygen.

Polyimide resin, thin film and method for manufacturing thereof

A metal laminate comprising a metal layer and an insulating layer is provided. The insulating layer is disposed on the metal layer and directly contacts the metal layer. The insulating layer is made of a polyimide resin, and the polyimide resin is derived from at least two dianhydrides and at least two diamines. The dianhydride monomers are selected from the group consisting of p-phenylenebis (trimellitate anhydride), 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride, 4,4&#x2032;-(4,4&#x2032;-isopropylidenediphenoxy)bis(phthalic anhydride) and the combination thereof. One of the diamine monomers is 2,2&#x2032;-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4&#x2032;-oxydianiline, 4,4&#x2032;-methylenedianiline, 4,4&#x2032;-diaminobenzanilide, 4,4&#x2032;-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof. A molar ratio of the dianhydride monomers to the diamine monomers is between 0.85 and 1.15.

Metal laminate with polyimide resin and method for manufacturing the same

The invention provides a vertical conductive unit. The vertical conductive unit comprises an insulating layer comprising a connecting via, a first conductor, a second conductor, and a third conductor. The insulating layer comprises photosensitive polyimide, and the glass transition temperature of the photosensitive polyimide is lower than about 200&#xb0; C. The invention also provides a method for manufacturing the vertical conductive unit.

Vertical conductive unit and manufacturing method thereof

A method of forming a component-embedded printed circuit board includes: preparing a first layered structure; preparing a second layered structure that includes an adhesive film and a releasable film; attaching the second layered structure to the first layered structure to form a layered stack, the releasable film releasably covering a mounting region of the first layered structure; heating and pressing the layered stack; cutting the second layered structure through the adhesive film; removing the releasable film together with a portion of the adhesive film from the mounting region to form a hole in the second layered structure; and mounting an electronic component in the hole.

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Tainan, Taiwan

Tang-Chieh Huang