Adeia Semiconductor Bonding Technologies Inc.

Tan Nguyen

Thomas H DiStefano

Craig S Mitchell

Joseph Charles Fjelstad

Konstantine N Karavakis

Anthony B Faraci

Dennis D Ikola

Microelectronic assemblies are encapsulated using disposable frames. The microelectronic assemblies are disposed within an aperture defined by a frame. The aperture is covered by top and bottom sealing layers so that the frame and sealing layers define an enclosed space encompassing the assemblies. The encapsulant is injected into this closed space. The frame is then separated from the encapsulation fixture and held in a curing oven. After cure, the frame is cut apart and the individual assemblies are severed from one another. Because the frame need not be held in the encapsulation fixture during curing, the process achieves a high throughput.

Encapsulation of microelectronic assemblies

A lamination machine includes means for using gas pressure to bring a coverlay and a microelectronic package into intimate contact and means for heating a coverlay adhesive in order to seal the coverlay to the package. A method of laminating a coverlay to a microelectronic package using the lamination machine includes using gas pressure to bring a coverlay into intimate contact with a microelectronic package. The method also includes heating an adhesive on the coverlay in order to adhere the coverlay to the package. Once the coverlay is laminated to the package, the package can be encapsulated with a curable encapsulant composition. The method may also include decreasing the pressure in the chamber disposed above the package to reduce voids and bubble and/or regulating the pressure in a bladder disposed in a chamber below the package. The lamination machine may also include a pressurized bladder which is used to support the microelectronic package and minimize stress on the leads during the lamination process.

Lamination machine and method to laminate a coverlay to a microelectronic package

A connector for microelectronic elements includes a sheetlike body having a plurality of active contacts arranged in a regular grid pattern. The active contacts may include several sheetlike metallic projections extending inwardly around a hole in the sheetlike element, on a first major surface of the sheetlike element. A support structure such as a grid array of noncollapsing structural posts is on a second major surface of the sheetlike element, and each of the posts is electrically connected to one of the active contacts. The grid array of posts and the grid array of active contacts are offset from one another so that an active contact is surrounded by several posts. The posts support the sheetlike element spaced away from a substrate to which the posts are attached. A microelectronic element having bump leads thereon may be engaged by contacting the bump leads with the active contacts, and deflecting the sheetlike element between the bump leads on one side and the posts on the other side. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Flexible connectors for microelectronic elements

A socket which compensates for non-planarities in a semiconductor device. The socket has a base with an aperture for receiving a semiconductor device and a plurality of bond pads within the aperture. The bond pads are typically electrically connected to external circuitry in some fashion. The socket also includes a lid which has a spring loaded portion for applying a force on a back surface of a semiconductor device when a major surface of the lid is in intimate contact with a major surface of the base such that contacts on the semiconductor device may make electrical contact to the bond pads while compensating for non-planarities in the semiconductor device. This compensation scheme is located in the spring loaded portion of the lid. This compensation scheme may also be aided through the use of a compliant, and perhaps compressible, interposer disposed between the semiconductor device's contacts and the bond pads.

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Santa Clara, CA, United States of America

Tan Nguyen