Micron Technology Incorporated

Tan Kok Chua

Neo Chee Peng

Chew Beng Chye

Tan Hock Chuan

Lim Guek Har

Ho Kian Seng

Tay Liang Chee

Toh Kok Seng

Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.

Method and apparatus for cutting semiconductor wafers

Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.

Method for cutting semiconductor wafers

A method and apparatus are provided for assembling a semiconductor package. The invention uses a thin release film placed over package components in a mold cavity. The release film is drawn down over the assembled components and envelops the assembled components with an airtight seal around at least three sides for assisting and defining the flow of encapsulant into empty space between components. A mold compound is flowed into the empty space, assisted by vacuum or air pressure at the airtight seal. The release film is pulled up and away from the assembled components, permitting encapsulant to flow into the remainder of the mold cavity.

Underfill applications using film technology

Growing community of inventors

Singapore, Singapore

Tan Kok Chua