Matsushita Electric Industrial Co., Ltd.

Tamotsu Wakahata

Takao Inoue

Junji Ikeda

Yukio Maeda

Tadashi Sakairi

Yasutomo Funakoshi

Keigo Momose

Nobuhisa Maeda

Fumio Iwami

Keizi Saeki

Iwao Shirai

Tadashi Sawai

Masakazu Komatsu

Ikuo Niboshi

Hideyuki Yamada

Ryuzo Hochin

Tadashi Sakaira

A directly moldable resin composition for a composite plastic is disclosed, which comprises a predetermined amount of a mixture of pellets of a thermoplastic synthetic resin having an average size of 2.0 mm or larger and particles of a thermoplastic resin having an average size in a predetermined range, or particles of a thermoplastic resin alone having an average size of below 900 microns, and the balance of at least one filler such as particulate inorganic fillers or fibrous fillers. The particles of a thermoplastic resin should preferably be contained in an amount equal to or higher than 100% by volume of the at least one filler. When determined by a suspending tensile failure method at a tension speed of 2 mm/cm.sup.2, a particulate filler should preferably have an adhesion force in the range of below 4 g/cm.sup.2. Greater amounts of the mixture or the particles of thermoplastic resins can be used when the filler is treated on the surface thereof with organic compounds with a H.L.B. value below 13 so as to improve affinity for synthetic resins.

Directly moldable resin compositions for composite plastics

Composition is characterized in that ethylenically unsaturated group (CH.sub.2 .dbd.C&lt;) operation is performed, under the existence of dispersion agent and antioxidant, to polyolefin series composition, and at least one kind of epoxy group and amino group is filler-graft-bonded with olefin through organic peroxide.

Polyolefin series composition comprising surface treatment of filler and

An alkaline galvanic cell including a container serving for a cathode terminal, a sealing plate in the form of a layered clad plate serving for an anode terminal to be fitted into the container, and an insulating packing provided between the sealing plate and container for sealing the cell upon assembly. The cell is provided with a layer of epoxy adduct polyamide amine having amine valence in the range of 50 to 400 and disposed between the innermost copper layer of the sealing plate arranged to be readily amalgamated and the insulating packing so as to serve as a sealing agent or liquid leakage suppression agent.

Alkaline galvanic cell

There is provided a coating composition (B) consisting essentially of:

Radiation curable coating composition comprising three or more (meth)

An improved alkaline galvanic cell which includes an anode sealing plate of a layered structure serving as an anode terminal and having a copper layer as the innermost layer, a cathode container serving as a cathode terminal, an insulating packing provided around the peripheral edge of the anode sealing plate to be fitted into the cathode container for hermetically sealing the cell, and two layers of sealing agents provided between the anode sealing plate and the insulating packing. One of the layers at the side of the anode sealing plate is of epoxy adduct polyamide amine having amine valence in the range of 50 to 400, while the other of the layers at the side of the insulating packing is arranged to be of chlorosulfonated polyethylene for improvement of resistance against leakage of electrolyte.

Coating compositions comprising 100 parts by weight of a mixture composed of 50-98% by weight of at least one multifunctional monomer selected from compounds having 3 or more acryloyloxy groups and/or methacryloxy groups in 1 molecule, and 2-50% by weight of a bifunctional oligomer represented by the following general formula ##STR1## wherein R.sub.1 represents hydrogen or methyl, and n is an integer of 1 through 5, 0.01-10 parts by weight and polymerization inhibitor 10 through 2,000 ppm of a polymerization inhibitor, and being capable of forming a bridge hardened film of superior abrasion resistance, etc. by the application of activation energy rays, and resin moldings using the coating compositions.

Coating compositions and resin moldings using same

In a rear projection screen for a color television projector, having a plurality of lenticular lenses on one surface thereof, the contour of the cross-section of each lenticular lens is simply formed of a pair of linear portions and an arcuate portion interposed between the pair of linear portions. Thus, a mold for manufacturing the screen can be simply and readily machined so as to provide low cost screens, while the picture on the screen looks satisfactorily when viewed from various view points throughout a wide angle.

Rear projection screen for a color television projector

An improved method of manufacturing a composition for bonded magnets in which deterioration of the composition due to heat is prevented, while uniform dispersion of ferrite powder is achieved for stabilization of physical properties and various characteristics of the resultant bonded magnets.

Method of manufacturing composition for bonded magnets

A method of mounting electronic components on a printed circuit board by temporarily attaching the electronic component (4) to the circuit board (1) with adhesive (3) applied to the board (1), irradiating the adhesive (3) with ultraviolet rays with or without heating to cure the adhesive (3) and thereby rigidly attach the component (4) to the board (1), and thereafter joining the electrodes (5) of the component (4) to conductor portions (2) on the board (1). Excess adhesive portions (3a) adjoining the component (4) are cured first to subsequently cure the other portion of the adhesive (3) in chain relation to the curing of the excess.

Growing community of inventors

Katano, Japan

Tamotsu Wakahata