Araco Kabushiki Kaisha

Tamotsu Nagaya

Makoto Suzuki

Hitoshi Heta

Shigenori Hirota

Nobuhiro Minami

Shinji Tomita

Masahiko Uchida

Kouichi Oshitani

Toshiaki Kondo

Mitsuharu Aoyama

Combined boards are taught that comprise a second board substrate () having a through bore () formed therein, a first board substrate (), and a connector pin () received in the through bore () of the second board substrate (). The first and second board substrates overlap such that the through bore () of the second board substrate () is covered by a first surface () of the first board substrate (). The connector pin is fusion bonded to a circumferential surface of the through bore () and the first surface () of the first board substrate ().

Combined boards and methods for manufacturing the same

Apparatus for manufacturing a molded article having a substrate material and skin material may include a first die that receives and supports the substrate material and a second die that receives and supports the skin material. The first die is arranged and constructed to engage the first die. A cutter may be provided on the first molding die. The cutter can be actuated when the second die moves toward the first die in order to partially cut away the substrate material.

Methods and apparatus for manufacturing molded articles

A granular, ground filler of plant origin, such as kenaf fiber, is mixed into a synthetic resin to form a melted synthetic resin Ca, which is extruded from an output port of a low-pressure extruder as an intermediate resin layer C. A first coating material A and a second coating material B are superimposed on the two surfaces of the intermediate resin layer C. Thereafter, both coating materials A and B are pressed and adhered to the melted intermediate resin layer C by a roller press

Resin formed product and methods and devices for making the same

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Toyota, Japan

Tamotsu Nagaya