Adeka Corporation

Rinrei Wax Co., Ltd.

Tamotsu Nagamatsu

Ryo Ogawa

Keisuke Ota

Mitsunori Ide

Ken-ichi Tamaso

Masato Inadome

Konosuke Yagi

Satoshi Kaneda

Tetsuya Umehara

Shimon Nishida

Tatsumi Kosaka

Shota Kobayashi

Yukako Ishigami

Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.

Curable resin composition

Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

To show a curable resin composition suitable as an adhesive for bonding a structural material having good adhesiveness to aluminum in particular. A curable resin composition containing (A1) phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (a1) and an epoxy compound (a2) (excluding a urethane-modified epoxy resin and a urethane-modified chelate epoxy resin); and (A2) an epoxy resin (excluding component (A1)); (B) a block urethane; and (C) a latent curing agent, in which a phosphorus content in a total mass of component (A1) and component (A2) is 0.01 to 2.0% by mass.

Curable resin composition and adhesive for bonding structural material using composition

A strippable coating composition for floors which contains at least 50% by weight of an aqueous polyurethane resin relative to the total solid content, wherein the hydroxyl-containing compound component constituting the aqueous polyurethane resin comprises (A) a polyester polyol component prepared from 1,6-hexanediol and either an aliphatic dibasic acid and/or an aromatic dibasic acid, (B) a low-molecular alicyclic diol component, and (C) an unsaturated fatty acid ester polyol. The strippable coating composition can form a coating film that has a tear strength of 0.3N or more, a break strength of 10 MPa or more, and an elongation at break of 50% or more.

Strippable coating composition for floors

Growing community of inventors

Kuki, Japan

Tamotsu Nagamatsu