Asahi Kasei Chemicals Corporation

Tamotsu Kodama

Hiroshige Okamoto

Masataka Nishi

Tsutomu Akiyama

Satoru Kaji

Ryoko Watanabe

The present invention relates to a curable resin composition comprising (A) an epoxy compound having three or more epoxy groups in one molecule and (B) an active hydrogen compound.

Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element

An absorbent composite comprising: a base material and water-absorbent resin particles; wherein the following conditions (1) to (4) are fulfilled: (1) the weight ratio of water-absorbent resin relative to the total weight of the base material and water-absorbent resin is 65 to 99 wt %, (2) the water-absorbent resin particles adhering directly to the base material constitute 50 wt % or more of the total water-absorbent resin particles; (3) the average absorption capacity of the water-absorbent resin particles is 50 g/g or more; and (4) the amount of residual monomers in the water-absorbent resin is 200 ppm or less.

Absorbent composite material and method for manufacturing the same

Absorbent composite material comprising water-absorbent resin particles having specific surface strength, and method for manufacturing the same

Absorbent composite material and bodily fluid-absorbing article comprising water-absorbent resin particles having specific surface strength

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Tokyo, Japan

Tamotsu Kodama