Sony Corporation

Tamotsu Kiyakawauchi

Shigeru Arisawa

Yoichi Uramoto

Uichiro Omae

Masakazu Yajima

Nobuharu Murashima

Hideo Niikura

Chisako Kajihara

Masaaki Masuda

Hiromitsu Komatsu

Tomoyasu Yamada

Junya Matsui

Shingo Seto

Koji Shiozawa

Kaori Morita

Akitomi Katsumura

A power receiving coil and a measuring coil are in a power receiving device. The measuring coil is inductively coupled to the power receiving coil. Concentric turns of a wire in the measuring coil are around a common axis. Also around the common axis are concentric turns of a wire in the power receiving coil. At least one of the concentric turns of the wire in the measuring coil is closer to the common axis than each of the concentric turns of the wire in the power receiving coil. A power feeding device receives a control signal from the power receiving device. The control signal instructs the power feeding device to adjust a power level of an electromagnetic wave emission.

Power receiving device and power feeding system

A detection apparatus includes: a measurement coil disposed in a vicinity of a power reception coil configured to receive power supplied through a magnetic field; a measurement section configured to measure a voltage of the measurement coil as a measurement coil voltage; and a foreign object detection section configured to obtain an electrical characteristic value of at least one of the power reception coil and the measurement coil on the basis of the measurement coil voltage, and to detect a foreign object in the magnetic field if the electrical characteristic value is lower than a predetermined lower limit threshold value.

Detection apparatus, power supply system, and method of controlling detection apparatus

[Object] To provide a signal transmission device and management system which are capable of transmitting a signal including information of an attachment target or information of the surrounding of an attachment target. [Solution] A management system includes: a signal transmission device which includes a housing that is attached to an object to be managed in a predetermined direction, a first optical power generation unit and a second optical power generation unit that have light receiving units on a first surface and a second surface facing outwardly in a predetermined direction, respectively, a first temperature sensor and a second temperature sensor that have thermal contacts on the first surface and the second surface, respectively, a communication control unit for transmitting a signal including temperature information detected by the first temperature sensor and the second temperature sensor using power generated by at least one of the first optical power generation unit and the second optical power generation unit; and an information processing device which has a control unit for receiving a signal transmitted from the signal transmission device and outputting the state information of an object to be managed to which the signal transmission device is attached on the basis of the temperature information detected by at least the first temperature sensor and the second temperature sensor.

Signal transmission device and management system

Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals. The superposition junction between the semiconductor package section and the substrate section is provided with such an offset that the card-side connector protrudes out off the card device.

Card device

Growing community of inventors

Aichi, Japan

Tamotsu Kiyakawauchi