Texas Instruments Corporation

Tammy J Lahutsky

Dennis D Davis

Buford H Carter, Jr

Stephen R Nelson

Glen R Haas

Charles W Suckling

Glenn Collinson

John Barnett

This is a device package comprising: a leadframe comprising a plurality of leads for effecting circuit connections to the device; and a metal ground piece connected to the leadframe. Other devices and methods are also disclosed.

RF device package for high frequency applications

This is a package [10] for an rf device [11] operable with a characteristic impedance providing a plurality of terminals [12-19] and [101] for effecting circuit connections to the device, the connection between at least one of the terminals and the device being matched in relation to the characteristic impedance. Other devices and methods are also disclosed.

Device packaging

Growing community of inventors

Plano, TX, United States of America

Tammy J Lahutsky