Dow Corning Corporation

Dow Corning Toray Company, Ltd.

Tammy Cheng

Mark Dobrzelewski

Daniel Solomon

Christopher Windiate

Yoshitsugu Morita

Makoto Yoshitake

Randall Gene Schmidt

John Bernard Horstman

Hiroji Enami

Gary Michael Wieber

Tomoko Kato

Brian Harkness

Michael Salvatore Ferritto

Gerald Lawrence Witucki

Glenn Gordon

Ann Walstrom Norris

Masayoshi Terada

Michelle R Cummings

Masashi Murakami

Malinda Howell

A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.

Process for fabricating electronic components using liquid injection molding

A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si&#x2014;H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones

This invention relates to urethane compositions comprising: (A) 100 weight parts of at least one compound containing at least one isocyanate group; (B) 0.3-300 weight parts of a carbinol-functional silicone resin; (C) up to 250 weight parts of an organic polyol; and (D) up to 10 weight parts of a cure rate modifier. The urethane compositions of this invention are useful as a stand-alone coating or as ingredients in protective coatings, paint formulations, and powder coatings. The urethane compositions of this invention can also be formulated with a blowing agent and cell stabilizer to produce thermally stable foam formulations.

Urethane compositions containing carbinol-functional silicone resins

Growing community of inventors

Midland, MI, United States of America

Tammy Cheng