Hitachi Powdered Metals Co., Ltd.

Denso Corporation

Tamio Takada

Chio Ishihara

Kei Ishii

Kazuo Asaka

Isao Makino

Hideo Shikata

Zenzo Ishijima

Masaki Shimizu

Tsuyoshi Akao

Junichi Ichikawa

The present invention provides a production method for a powdered core, including steps of preparing a mixture including a soft magnetic powder and a resin powder to obtain a mixture, compacting the mixture into a predetermined shape to obtain a green compact and heating the green compact, and wherein the resin powder has a median size of not more than 50 &#x3bc;m, and the resin powder amount is 0.01 to 5 vol %. The method reduces production cost, and decreases eddy-current loss Wand hysteresis loss W, whereby a powdered core in which a durability is improved and the technical advantages are expanded can be provided.

Production method for powdered core

Disclosed is a thin plate member for forming a semiconductor package, having a recess for receiving a semiconductor chip. The thin plate is composed of sintered metal, e.g. sintered copper or sintered alluminum alloy. A sintered metal body being porous and having a shape which is close to the shape of the thin plate member is prepared, and it is sized into the shape of the thin plate member. The sintered alluminum alloy comprises 0.4 to 0.8% by weight of magnesium, 0.2 to 0.6% by weight of silicon and the balance aluminum and has a structure comprising an aluminum phase being formed of aluminum particles and an alloy phase being composed of magnesium, silicon and aluminum and interposing between the aluminum particles, and the sintered copper has a metallographic structure comprising a phase of copper particles.

Thin plate member for semiconductor package and manufacturing method therefor

Growing community of inventors

Kashiwa, Japan

Tamio Takada