Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Shoei Printing Co., Ltd.

Tamio Saito

Masayuki Ohuchi

Yoshikatsu Fukumoto

Toshio Nakai

Kouhei Suzuki

Hirosi Oodaira

Ken-ichi Mori

Shuji Hiranuma

Hiroshi Kobayashi

Satoshi Takayama

Osamu Shimada

Atsuko Iida

Takeshi Miyagi

Tadashi Sekiguchi

Kunio Yoshihara

Toshio Sudo

Yoshiyuki Suda

Shigekazu Hori

Akira Niitsuma

Shigeyuki Oe

Takanori Kisaka

Ko Kishida

Hiromi Kobayashi

Kunio Yosihara

Kiyomi Tagaya

Plural semiconductor elements are buried into an insulating substrate, and top surfaces of semiconductor elements and the substrate are in a same plane. A photosensitive dry film is covered on surfaces of the substrate and semiconductor elements. The photosensitive dry film has openings corresponding to electrodes of semiconductor elements, and conductors are filled in openings of the photosensitive dry film. The device has the multi-layer wiring construction without damaging to semiconductor elements arranged on the substrate.

Electronic circuit device and method of manufacturing same

A semiconductor integrated circuit device according to the present invention comprises a chip substrate formed of a semiconductor. Formed on a surface of the chip substrate is an integrated circuit and a plurality of chip terminals which are located to the outside of the integrated circuit, so as to be connected thereto. An electrical insulating layer covers the entire surface of the chip substrate, and conductor leads equal in number to the chip terminals are formed on the insulating layer. One end of each conductor lead is connected to a corresponding chip terminal, and the other end thereof is formed having a connecting terminal whose surface area is greater than that of each chip terminal. The connecting terminals are distributed substantially over the entire surface of the insulating layer.

Semiconductor integrated circuit device

An image sensor having first wires formed in parallel on a first region of a substrate; a semiconductor layer formed on the first region covering the first wires and on a second region of said substrate; first electrodes arranged in line, connecting to the semiconductor layer of said second region; second electrodes arranged in line and connected to the semiconductor layer of said second region, and second wires extended from the first electrodes, the second wires connecting the first electrodes to said first wires at through holes formed in said semiconductor layer. The second electrodes are formed as a common electrode, and each of the first electrode, together with a portion of the second electrode facing the first electrodes and the semiconductor layer forming a photo-sensing element.

Image sensors using a photo-sensing element array and matrix wires

An image sensor, comprising a semiconductor layer formed on at least a first region of a substrate; first electrodes arranged in line and electrically connected to the semiconductor layer of said first region; and second electrodes arranged in line and electrically connected to said semiconductor layer of said first region. The second electrodes are respectively formed as a common electrode, and each of the first electrodes, a portion of said second electrode facing the first electrode and the semiconductor layer positioned therebetween form a photo-sensing element. First wires respectively extend from said first electrodes to a second region of said substrate. An insulating layer is continuously formed on the first and second regions, covering said photo-sensing elements and the first wires as well as second wires formed in parallel on the insulating layer of said second region. The second wires are electrically connected to the first wires at through holes formed in the insulating layer.

Image sensors and methods of manufacturing same including semiconductor

A microchannel plate has a platelike photosensitive glass substrate and a plurality of microchannels formed separately from each other and extending across the thickness of the substrate. A secondary electron-emission surface is formed on an inner surface of each of the microchannels. Accelerating electrodes formed on two opposite sides of the photosensitive glass substrate, so as to be partially in electrical contact with the secondary-emission surface. The microchannels are formed by applying ultraviolet rays to the substrate through a mask and removing irradiated portions of the substrate by etching.

Microchannel plate and a method for manufacturing the same

A contact-type linear image sensor has two separate substrates aligned adjacent to each other. A linear array of amorphous silicon photoelectric converting elements serving as photoelectric cells and a matrix wiring unit are provided on a first substrate. Driver IC chips are mounted on a second substrate. Connection pad patterns for common cell electrodes of cell groups and connection pad patterns for row signal lines of the matrix wiring unit are provided concentrically at a peripheral edge of the first substrate to be aligned along a junction edge line defined between the substrates. Connection pad patterns for the IC chips are linearly aligned at a peripheral edge of the second substrate and along the substrate junction edge line to oppose the pad patterns of the first substrate. A connector unit for electrically connecting the pad patterns of the first and second substrates may be provided at only one position of the junction edge portion of the first and second substrates.

Solid state image sensor with cell array of amorphous semiconductor

In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.

IC card and method for manufacturing the same

A circuit board is prepared such that at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.

A method of making a circuit board and a circuit board produced thereby

In an optical sensor, a heating element is formed on a substrate, and an amorphous semiconductor film is formed on an insulating layer covering the heating element, and is electrically insulated from the heating element. A common electrode and a plurality of electrodes are also formed on the substrate and are extended along the amorphous semiconductor film, to form cells for converting light into electrical signals, in the amorphous semiconductor film. An electric current is supplied to the heating element, to heat the amorphous semiconductor film after the film has been illuminated and photoelectric current has been picked up from the electrodes.

Optical sensor having heating element to heat amorphous semiconductor

A photoelectric conversion element comprises a substrate, a plurality of separate electrodes arranged in a row on the substrate, signal lead-out parts extending from the separate electrodes alternately to the left and the right in a direction perpendicular to the arranging direction of the separate electrodes, a photoelectric conversion layer covering the row of the separate electrodes, a transparent electrode formed on the photoelectric conversion layer, and a light shielding conductive layer formed on the transparent electrode. The light shielding conductive layer is shaped to shield the light beam projected toward the overlapping portion between at least those portions of the signal lead-out parts which abut against the separate electrodes and the photoelectric converison layer.

Photoelectric conversion element with light shielding conductive layer

A contact type color image sensor reads out a document image at its actual size while moving along the length of the document. The photosensitive cell arrays, each having pixel electrodes which prescribe n photosensitive cells (where n is a positive integer), are aligned on the substrate. Filter films are positioned over the cell arrays. The radiated image light is converted into the three primary color components of red, green and blue, and R, G, B color signals necessary for color reproduction of the document image are obtained from the respective cell arrays. The n photosensitive cells are arranged at a predetermined pitch p along the main scanning direction X in each array, and the cell arrays are arranged at a sub-scanning direction pitch q which is larger than the pitch p by a factor of K (where k is larger than 1 and k.times.n is a natural number).

Color image sensor

A contact-type color image sensor in which pixel electrodes are linearly provided in a main scanning direction and three (or four) rows thereof are arrayed in a subscanning direction, color filters for color-separating are provided to oppose the pixel electrodes, an amorphous semiconductor film is formed on the pixel electrodes, and a common transparent electrode is formed on the amorphous semiconductor film. This color image sensor allows color-separation in the subscanning direction to maximize the areas of pixel electrodes.

Contact color image sensor

A circuit board comprises a substrate made of a semi-insulating or insulating material, an insulating layer formed on the substrate and having a lower dielectric constant than the dielectric constant of the substrate, and a plurality of wiring conductors formed at predetermined intervals on the insulating layer. The insulating layer has a thickness determined according to the distance between adjacent wiring conductors and equal to 0.5 to 2.5 times the distance noted above, for the purpose of reducing cross-talk noise.

Circuit board

The credit card includes an IC module having a data processing function, an insulation body for holding the IC module, and a plurality of terminals which are formed on the insulation body. The plurality of terminals are first and second contact pads to which a drive power and a data signal are supplied. The IC module is formed between the first and second contact pads.

Card with an IC module

An image sensing device including an array of photovoltaic conversion elements on a substrate to convert incident light from an image plane to be read into electrical signals. The electrical signals are transferred to a plurality of signal reading circuits, which are constructed by a plurality of integrated circuits, via a plurality of conductive strips defining wiring patterns of non-uniform lengths formed on the substrate. The sums of the areas of the conductive strips with the areas of the electrodes to which the conductive strips are connected are made substantially equal in each of the electrode-conductive strip pairs to make the sums of the stray capacitances of the conductive strips and the interelectrode capacitances of the photovoltaic conversion elements substantially equal.

Growing community of inventors

Tokyo, Japan

Tamio Saito