Intel Corporation

Tamil Selvy Selvamuniandy

Munehiro Toyama

Kian Sin Sim

Siew Fong Tai

Charan K Gurumurthy

Charavanakumara Gurumurthy

Sheng C Li

Liang Zhang

Zhihua Zou

A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

Grid array connection device and method

The present disclosure relates to the field of microelectronic substrate fabrication and, more particularly, to alignment inspection for vias formed in the microelectronic substrates. The alignment inspection may be achieved by determining the relative positions of fluorescing and non-fluorescing elements in a microelectronic substrate.

Alignment inspection

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Chandler, AZ, United States of America

Tamil Selvy Selvamuniandy