Intel Corporation

Tamanna Husain

Ranjith Kumar

Srinivasa Chaitanya Gadigatla

James Graeber

Kohinoor Basu

Abhinand Ramakrishnan

An integrated circuit structure includes a first metal level comprising a first plurality of interconnect lines along a first direction. A cell is on at least the first metal level, the cell having a pin comprising more than two of the first plurality of interconnect lines. A second metal level comprising a second plurality of interconnect lines overlays the first metal level, where the second plurality of interconnect lines is along a second direction. Two or more vias are on at least one of the second plurality of interconnect lines to connect to the pin.

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El Dorado Hills, CA, United States of America

Tamanna Husain