Daicel Corporation

Tamaki Son

Takashi Kubo

Takahiro Iwahama

Kiyoshi Ikura

Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows:

Photosensitive resin composition, cured product thereof, and optical component

Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows:

Photosensitive resin composition and cured article of same, and optical component

Provide is an oxetane-ring containing (meth) acrylic ester compound which can give, through polymerization, a cured article being highly flexible or thermally stable. The oxetane-ring-containing (meth) acrylic ester compound is represented by formula (1) below, in which Rrepresents a hydrogen atom or an alkyl group; Rrepresent a hydrogen atom or a methyl group; and 'A' represent either a linear alkylene group represented by following formula (a1) or a branched-chain alkylene group represented by following formula (a2). 

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Himeji, Japan

Tamaki Son