Canon Kabushiki Kaisha

Canon Kabushiki Kaisha Kaisha

Tamaki Sato

Takumi Suzuki

Masahiko Kubota

Kazuhiro Asai

Ryoji Kanri

Akihiko Okano

Tetsushi Ishikawa

Maki Kato

Masafumi Morisue

Maki Hatta

Hiromichi Noguchi

Isao Imamura

Akihiko Shimomura

Hiroe Ishikura

Shoji Shiba

Yasuaki Tominaga

Shuichi Murakami

Yoshinori Tagawa

Manabu Otsuka

Hirono Yoneyama

Hiroshi Tajika

Junichi Kobayashi

Masataka Kato

Nobuyuki Kuwabara

Naozumi Nabeshima

Toru Yamane

Norio Ohkuma

Yoshikazu Saito

Masaki Ohsumi

Etsuko Hino

Akira Yamamoto

Kazuhiro Yamada

Kenji Fujii

Seiichiro Karita

Yasuyuki Tamura

Keiji Watanabe

Akio Saito

Shingo Okushima

Shuzo Iwanaga

Takashi Inoue

Keiichi Murakami

Masashi Miyagawa

Hideo Tamura

Aya Yoshihira

Mineo Kaneko

Noriyasu Nagai

Takatsuna Aoki

Toshiyasu Sakai

Takayuki Teshima

Genji Inada

Michinari Mizutani

Atsunori Terasaki

Kazuhiro Nakajima

Jun Kawai

Hiroyuki Murayama

Masayoshi Tachihara

Zentaro Tamenaga

Isamu Horiuchi

Yoshiyuki Fukumoto

Yasutomo Watanabe

Taichi Yonemoto

Hiroshi Higuchi

Tatsurou Mori

Hiroaki Toshima

Shinji Kishikawa

Shinsuke Tsuji

Atsushi Hiramoto

Takayuki Kamimura

Yoshinao Ogata

Masamichi Yoshinari

Hirono Naito

A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Method of producing structure, protective substrate, and method of producing protective substrate

In a substrate of a liquid ejection head, there are formed a first through-hole which constitutes a liquid supply path, and a second through-hole in which a through-hole electrode electrically connected to a wiring layer is formed on the inner surface. The first through-hole has a first hole having a first opening and a second hole having a second opening, and the second through-hole has a third hole having a third opening and a fourth hole having a fourth opening. When the minimum width of the first opening is represented by D, the minimum width of the second opening is represented by D, the minimum width of the third opening is represented by D, and the minimum width of the fourth opening is represented by D, the first to fourth openings satisfy a relation of D&#x3e;D&#x3e;D&#x3e;D

Liquid ejection head and method for manufacturing the same

A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.

Method of forming space for use in analysis devices

A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X&#x2265;30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

Method for manufacturing structure

A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.

Pressing method for surface of resin layer

A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.

Liquid ejection head, liquid ejection apparatus, and manufacturing method

There is provided a method for laminating a smooth thin resin layer on a substrate in manufacturing a liquid ejection head by a casting method. To achieve this, a resin layer having a sufficient thickness to fill a concave portion already existing on the substrate is applied and smoothed. Thereafter, a plurality of opening patterns (concave portions) are formed and then smoothed again to obtain a thin resin layer having a desired thickness.

Method for manufacturing liquid ejection head

A method for manufacturing a structure having a substrate in which holes are formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes includes a process of preparing a substrate in which holes formed by a surface in which a wavelike shape is formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes and an exposure process of exposing the photosensitive resin layer on the substrate.

There is provided a method for forming a smooth resin layer on a substrate having a concavo-convex portion in manufacturing a liquid ejection head by a casting method. To achieve this, after forming an opening pattern on the resin layer formed on the substrate, a mold is brought into contact with the resin layer at a predetermined pressure so as to smooth a surface of the resin layer.

A manufacturing method of a liquid ejection head, which includes a step of preparing a substrate including a first layer, a step of forming a flow path mold for forming the flow path and a member located outside the mold with a gap between the mold and the member from the first layer, a step of providing a second layer so that the second layer fills the gap and covers the mold and the member located outside the mold with the gap between them, a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer, a step of removing the member located outside the mold with the gap between them, and a step of forming a wall member located outside the ejection orifice forming member with at least a partial gap between the ejection orifice forming member and the wall member.

Manufacturing method of liquid ejection head

This invention relates to a manufacturing method of a liquid discharge head comprising: forming an active energy ray-curable resin layer on a surface of a substrate on which discharge energy generating elements are formed, attaching a material permeable to active energy rays onto a surface of the active energy ray-curable resin layer, pressing against the material permeable to active energy rays, a master mold being transparent to the active energy rays and having protrusions corresponding to a pattern of discharge ports so as to transfer the protrusions to the material permeable to active energy rays, selectively irradiating the active energy ray-curable resin layer with active energy rays according to a pattern of liquid flow paths so as to cure the active energy ray-curable resin layer, removing the master mold, and removing uncured portions of the active energy ray-curable resin layer.

Manufacturing method of liquid discharge head

A method of manufacturing a liquid discharge head having a flow path communicating with a discharge port for discharging liquid includes in the following order: preparing a substrate with an evenly provided first layer as a flat layer; forming, of the first layer, a pattern of the flow path for forming the flow path, and a member (A) provided outside the pattern via a gap; providing a second layer so as to fill the gap and to cover the pattern and the member (A); forming, of the second layer, a member (B) for forming the discharge port on the pattern; and removing the member (A), providing, at least on the substrate, a third layer so as to hold it in intimate contact with the member (B), and removing the pattern to form the flow path.

Liquid discharge head manufacturing method

A process for producing a liquid ejection head including, on a substrate, a flow path forming member forming ejection orifices and a liquid flow path communicating therewith, including forming, on the substrate, a first layer of photosensitive resin; forming, on the first layer, a mask layer in which at least part of a side surface thereof has a light transmission distribution with a material capable of reducing transmission of light having a photosensitive wavelength of the resin; performing, for the first layer, exposure with the mask layer and development to form a flow path mold pattern having a taper angle &#x3b8; satisfying 95&#xb0;&#x3c;&#x3b8;, where &#x3b8; is the angle between top and side surfaces in cross section of the pattern perpendicular to substrate surface; forming a coating resin layer to cover the pattern; patterning the resin layer to form the member; and removing the pattern to form the flow path.

Process for producing a liquid ejection head

Provided is a method of manufacturing a liquid injection head, the method including: forming, on a substrate, a negative photosensitive resin layer having a first surface on a side opposite to the substrate and a second surface on the substrate side; carrying out first exposure of the negative photosensitive resin layer; carrying out second exposure of the negative photosensitive resin layer; and forming the ejection orifice by carrying out development after the first exposure and the second exposure in which each of the first surface and the second surface has a portion in which a part of the unexposed portion in the first exposure and a part of the unexposed portion in the second exposure overlap and a portion in which a part of the unexposed portion in the first exposure and a part of the unexposed portion in the second exposure do not overlap.

Method of manufacturing liquid injection head and exposure method

A liquid discharge head includes a first substrate having an energy generating element for discharging a liquid, and a second substrate which is bonded to the first substrate and which has a discharge port for discharging the liquid and a groove that forms a passage for supplying the liquid to the energy generating element, wherein one surface of the second substrate on the front surface side of the liquid discharge head and the other surface thereof, which is the back surface of the one surface, are individually provided with recesses.

Liquid discharge head

Growing community of inventors

Kawasaki, Japan

Tamaki Sato