Kla Corporation

Kla Tencor Corporation

Tal Yaziv

Roie Volkovich

Yoel Feler

Barak Bringoltz

Ohad Bachar

Yuval Lamhot

Noga Sella

Ido Adam

Lilach Saltoun

Tom Leviant

Amnon Manassen

Daniel Kandel

Nuriel Amir

Anna Golotsvan

Tal Marciano

Evgeni Gurevich

Boris Efraty

Nadav Carmel

Renan Milo

Nir BenDavid

Dror Alumot

Ofer Zaharan

Oded Kaminsky

Amir Handelman

Zeng Zhao

Yaron De Leeuw

Eltsafon Ashwal-Island

Martin Mayo

Alon Yagil

Eltsafon Ashwal

Roee Sulimarski

Moshe Cooper

Ze'ev Lindenfeld

Yaron Deleeuw

Methods, metrology modules and target designs are provided, which improve the accuracy of metrology measurements. Methods provide flexible handling of multiple measurement recipes and setups and enable relating them to landscape features that indicate their relation to resonance regions and to flat regions. Clustering of recipes, self-consistency tests, common processing of aggregated measurements, noise reduction, cluster analysis, detailed analysis of the landscape and targets with skewed cells are employed separately or in combination to provide cumulative improvements of measurement accuracy.

Accuracy improvements in optical metrology

A system for analyzing one or more samples includes a sample analysis sub-system configured to perform one or more measurements on the one or more samples. The system further includes a controller configured to: receive design of experiment (DoE) data for performing the one or more measurements on the one or more samples; determine rankings for a set of target parameters; generate a recipe for performing the one or more measurements on the one or more samples based on the DoE data and the rankings of the set of target parameters; determine run parameters based on the recipe; perform the one or more measurements on the one or more samples, via the sample analysis sub-system, according to the recipe; and adjust the run parameters based on output data associated with performing the one or more measurements on the one or more samples.

System and method for analyzing a sample with a dynamic recipe based on iterative experimentation and feedback

A method and system for measuring misregistration between different layers of a semiconductor device, the method including providing a set of pupil inaccuracy scalable basis elements (PISBEs) relating to a plurality of patterned semiconductor device wafers (PSDWs), generating a single pupil image of a site on a PSDW, the PSDW being one of the plurality of PSDWs, by taking a single measurement of the site, the single pupil image including a plurality of site-specific pixels, calculating a set of site-specific pupil inaccuracy scalable basis element scaling factors (PISBESFs) for the single pupil image using the set of PISBEs and the plurality of site-specific pixels and calculating a site-specific misregistration value (SSMV) using the set of PISBEs and the set of site-specific PISBESFs.

Systems and methods for scatterometric single-wavelength measurement of misregistration and amelioration thereof

Methods are provided for deriving a partially continuous dependency of metrology metric(s) on recipe parameter(s), analyzing the derived dependency, determining a metrology recipe according to the analysis, and conducting metrology measurement(s) according to the determined recipe. The dependency may be analyzed in form of a landscape such as a sensitivity landscape in which regions of low sensitivity and/or points or contours of low or zero inaccuracy are detected, analytically, numerically or experimentally, and used to configure parameters of measurement, hardware and targets to achieve high measurement accuracy. Process variation is analyzed in terms of its effects on the sensitivity landscape, and these effects are used to characterize the process variation further, to optimize the measurements and make the metrology both more robust to inaccuracy sources and more flexible with respect to different targets on the wafer and available measurement conditions.

Method of analyzing and utilizing landscapes to reduce or eliminate inaccuracy in overlay optical metrology

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Kiryat Haim, Israel

Tal Yaziv