Kabushiki Kaisha Toshiba

Toyama Chemical Co., Ltd.

Public University Corporation Yokohama City University

Fujifilm Toyama Chemical Co., Ltd.

Takuya Takahashi

Hiroshi Iwasaki

Masatoshi Fukuda

Akio Katsumata

Jun Ohmori

Tomohiro Okuda

Takanori Jin

Tomoyuki Miyazaki

Tetsuya Suhara

Makoto Higuchi

Meiei Cho

Provided is a medicinal composition characterized by comprising an alkyl ether derivative represented by general formula [1] [wherein: Rand Rare the same or different and represent a hydrogen atom, a halogen atom, an optionally substituted Calkyl group, an optionally substituted aryl group, etc.; Rrepresents an optionally protected hydroxyl group, etc.; and m and n are the same or different and represent an integer of 1 to 6] or a salt thereof. The medicinal composition according to the present invention is useful as a post nerve injury rehabilitation effect-enhancing agent.

Post nerve injury rehabilitation effect-enhancing agent comprising alkyl ether derivative or salt thereof

The present invention provides a compound represented by formula (I), a pharmaceutically acceptable salt thereof or a solvate thereof. (In the formula, each of A and Z independently represents CO, SO or SO; each of X and Y independently represents S or O; each of R-Rindependently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group or a halogen group; each Rindependently represents an alkyl group, an alkenyl group, an alkynyl group or a halogen group; and n represents an integer of 0-4.) This compound is capable of specifically binding to an AMPA receptor, and shows extremely high brain uptake.

Compound that specifically binds to AMPA receptor

A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.

Semiconductor device and manufacturing method thereof

Semiconductor device with a thickness of 1 MM or less

There is provided a semiconductor device having a chip-size package structure comprising a semiconductor pellet including semiconductor elements, wires, a plurality of electrode pads, and final protection film, an insulation layer serving also as a sealing layer formed to cover the entire surface of the semiconductor pellet having a via hole portion above each of the electrode pads in association therewith, a plurality of wiring patterns formed with a via hole wiring portion electrically connected to the electrode pad at the bottom of each of the via hole portions of the insulation layer and formed with a land portion connected thereto and located in a position offset from the via hole portion, and an external electrode in the form of a ball provided on the land portion of each of the wiring patterns. This makes it possible to provide a semiconductor device in a chip-size package structure in which the length of wires led out from electrode pads is shortened as much as possible to lead out wires from electrode pads near the center of the pellet easily and to allow a pellet having an increased number of external electrodes to be accommodated.

Semiconductor device manufacturing method

An IC card includes a card-like substrate, an IC module, and an adhesive. The substrate is made of synthetic resin and has in one surface a hole for fixing the IC module. The IC module has a circuit board on which an IC chip is mounted and sealed with resin. The back side of the circuit board is provided with external connecting terminals which are electrically connected to the IC chip and exposed from the card-like substrate. The IC module is fitted into the hole of the card-like substrate such that an IC chip mounting section of the IC module is located inside the IC card. Using the adhesive, the IC module is fixed onto part of the inner surface of the hole of the card-like substrate without causing the chip mounting section to contact the inner surface of the hole.

IC card and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Growing community of inventors

Yokohama, Japan

Takuya Takahashi