Average Co-Inventor Count = 2.22
ph-index = 9
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Mitsubishi Electric Corporation (18 from 15,844 patents)
2. Mitsubishi Gas Chemical Company, Inc. (9 from 2,245 patents)
3. Funai Electric Company Ltd. (7 from 2,413 patents)
4. The Furukawa Electric Co., Ltd. (6 from 2,630 patents)
5. Mitsubishi Denki Kabushiki Kaisha (4 from 21,351 patents)
6. Nec Corporation (2 from 35,658 patents)
7. Mitsubishi Chemical Corporation (2 from 2,346 patents)
8. Hitachi Metals, Ltd. (2 from 2,333 patents)
9. Asahi Kasei Kabushiki Kaisha (2 from 942 patents)
10. Casio Computer Co., Ltd. (1 from 5,219 patents)
11. Advics Co., Ltd. (1 from 889 patents)
12. Hitachi Cable, Inc. (1 from 836 patents)
13. Ono Pharmaceutical Co., Ltd. (1 from 574 patents)
14. Eisai R&d Management Co., Ltd. (1 from 527 patents)
15. Asahi Kasei Chemicals Corporation (1 from 510 patents)
66 patents:
1. 12383974 - Steel joined body and method for manufacturing the same
2. 12312323 - Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
3. 12306289 - Radar device, method of detecting failure of radar device, and method of operating radar device
4. 12246389 - Steel joined body and method for manufacturing the same
5. 12221523 - Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
6. 12133339 - Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
7. 12036204 - Pharmaceutical composition for treating tumor
8. 12011775 - Steel joined body and method for manufacturing the same
9. 11921186 - Radar device, method of detecting failure of radar device, and method of operating radar device
10. 11767287 - Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
11. 11701304 - Dental restorative material and resin material for dentistry cutting formed of same
12. 11680139 - Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
13. 11643493 - Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
14. 11466123 - Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
15. 11452675 - Dental curable composition