C.uyemura Co., Ltd.

Takuya Okamachi

Masayuki Utsumi

Hisamitsu Yamamoto

Yoshikazu Saijo

Teruyuki Hotta

Naoyuki Omura

Takahiro Ishizaki

Junji Mizumoto

Syunsaku Hoshi

Fujio Asa

Takuya Komeda

Kanako Matsuda

The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.

Filling plating system and filling plating method

A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: CH&#x2014;(OCH)&#x2014;OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: CH&#x2014;(OCH)&#x2014;OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.

Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same

An tank such as an electroless copper plating tank, includes a liquid squirting parthaving a squirt portfor squirting the processing solution Q from the squirt porttoward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like workso that the processing solution Q runs down the plate-like work

Surface treating apparatus

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Osaka, Japan

Takuya Okamachi