Nissan Chemical Industries Limited

Nissan Chemical Corporation

Takuya Ohashi

Tomoyuki Enomoto

Mamoru Tamura

Takahiro Kishioka

Tetsuo Sato

A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a Calkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the &#x2014;O&#x2014; group in formula (1); and Ris a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent. 

Photocurable resin composition

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a Calkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent Chydrocarbon group, Z is a divalent Clinking group, the divalent linking group being bonded to an &#x2014;O&#x2014; group in formula (1), and Ris a hydrogen atom or a methyl group.)

Photosensitive adhesive composition

A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein Rand Rare each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.

Photosensitive resin composition and adhesives composition

There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, Ris a Calkylene group, a Calkenylene group or Calkynylene group, a Carylene group, a Ccyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Qis an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and Ris a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.

Polymer and composition including same, and adhesive composition

Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of Rand Ris independently a hydrogen atom, a Calkyl group, phenyl group, or a Ccyclic alkyl group, X is a single bond or a divalent organic group, and Y is a divalent organic group), and a terminal structure of the following Formula (1-b): (wherein Q is a Calkylene group, phenylene group in which at least one hydrogen atom may be substituted by a halogen atom, or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Ris a hydrogen atom or methyl group).

Thermosetting resin composition containing polymer having specific terminal structure

There is provided novel thermosetting resin composition. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1): {wherein each of Rand Ris independently a hydrogen atom or a Calkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2): (wherein Zis a carbonyl group or a &#x2014;CONH&#x2014; group, Zis a Calkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Zis a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a Calkyl group)}.

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Toyama, Japan

Takuya Ohashi