Sony Corporation

Sony Semiconductor Solutions Corporation

Mitsubishi Electric Corporation

Nec Corporation

Mitsubishi Chemical Corporation

Sony Olympus Medical Solutions Inc.

Takuya Nakamura

Satoru Wakiyama

Toshihiko Hayashi

Kan Shimizu

Naoki Jyo

Takayuki Tanaka

Makoto Murai

Yoshimichi Harada

Kentaro Akiyama

Keita Ishikawa

Naoki Komai

Shinji Katsuki

Toshiya Sugai

Mao Kawamura

Jun Ogi

Susumu Inoue

Junichiro Fujimagari

Yukio Tagawa

Mitsuaki Shiraga

Kazuharu Tazawa

Takanori Taniguchi

Manabu Hatakenaka

Junji Okada

Hayato Tanabe

Kana Nagayoshi

A semiconductor device includes a pad, a diffusion layer, and a melting layer. The pad included by the semiconductor device includes a concave portion on a surface at which solder connection is to be performed. The diffusion layer included by the semiconductor device is disposed at the concave portion and constituted with a metal which remains on the surface of the pad while diffusing into solder upon the solder connection. The melting layer included by the semiconductor device is disposed adjacent to the diffusion layer and constituted with a metal which diffuses and melts into the solder upon the solder connection.

Semiconductor device and manufacturing method of semiconductor device

Provided is a semiconductor device including a drive circuit which is provided on one surface of a semiconductor substrate and drives a light emitting element, one of or a plurality of the light emitting elements which is provided on another surface of the semiconductor substrate, and a through electrode which penetrates the semiconductor substrate and electrically connects the drive circuit with the light emitting element.

Semiconductor device and electronic equipment

A solid-state imaging device to be provided includes a first semiconductor device including a semiconductor layer in which a photoelectric conversion unit that photoelectrically converts incident light and a penetrating via are provided, a first connecting portion and a second connecting portion on the surface side of the semiconductor layer on the side that receives the light, and a connecting wiring line that connects the first connecting portion, the second connecting portion, and the penetrating via. The solid-state imaging device further includes a second semiconductor device that is mounted on the first semiconductor device with the first connecting portion. The solid-state imaging device is connected to an external terminal by the second connecting portion.

Solid-state imaging device and electronic apparatus

An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.

Semiconductor device and method of manufacturing the same

A through-hole via penetrating, in a thickness direction, through a circuit board provided with multiple wiring layers in which a conductor pattern is formed on a surface of an insulating layer, wherein the through-hole via has a first through-hole conductor that is disposed inside a hole penetrating through the circuit board and that is formed from a conductor; a second through-hole conductor that is disposed inside the hole so as to be spaced, in a circumferential direction of the hole, from the first through-hole conductor; a first land portion that connects the first through-hole conductor to the conductor pattern on one insulating layer; and a second land portion that connects the first through-hole conductor with the second through-hole conductor on another insulating layer different from the one insulating layer.

Through-hole via and circuit board

The power conversion device includes: a boost, converter which includes a magnetically-coupled reactor and a plurality of semiconductor switching elements connected to the magnetically-coupled reactor; an inverter; a cooler for cooling the magnetically-coupled reactor; a bus bar which is a conductive wiring member; and a current sensor for detecting a magnetic flux generated around the bus bar. The magnetically-coupled reactor includes a first winding, a second winding, and a core for magnetically coupling the first winding and the second winding. The core has a composite magnetic body containing soft magnetic powder and a binder, and at least parts of the first winding and the second winding are embedded in the composite magnetic body. The cooler is provided in contact with the magnetically-coupled reactor. The current sensor is provided on a side opposite to the magnetically-coupled reactor with the cooler therebetween.

Power conversion device

An object of the present invention is to provide a catalyst ensuring that when a gas-phase catalytic oxidation reaction of a material substance is conducted using a catalyst to produce a target substance, the pressure loss and coking are suppressed and the target substance can be produced in high yield. The present invention is related to a ring-shaped catalyst having a straight body part and a hollow body part, which is used when a gas-phase catalytic oxidation reaction of a material substance is conducted to produce a target substance, wherein a length of the straight body part is shorter than a length of the hollow body part and at least at one end part, a region from an end part of the straight body part to an end part of the hollow body part is concavely curved.

Catalyst and catalyst group

There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.

Semiconductor device and method of manufacturing thereof

An electric motor includes: a stator having a sleeve shape; a rotor inside the stator; a shaft coupled to the rotor and stretching along a central axis of the stator; a board case on one end side of the stator in a direction along the central axis; a circuit board on an opposite side of the stator with the board case interposed; a heat generating component on a mounting surface, which is opposite to a surface of the circuit board oriented to a side of the stator; a casing that covers a side of the mounting surface; and a heat transfer component between a surface of the casing that faces the circuit board and the heat generating component. The board case is provided with an extension portion that extends toward the circuit board. The heat transfer component is formed with a first engagement portion with which the extension portion engages.

Electric motor with a heat transfer component, circuit board and a ventilation fan

The present disclosure relates to a surgery support system, a display control device, and a display control method in which a plurality of images can be displayed in an easy-to-see and efficient manner. An information processing device generates a composite image by compositing images output from a plurality of electronic instruments including a medical instrument, and adds, to the composite image, metadata related to division of the composite image. The display control device controls a display device to display, in the virtual three-dimensional space, divided images obtained by dividing the composite image into a plurality of divided regions on the basis of the metadata. The present disclosure can be applied to an endoscopic surgical system, for example.

Surgery support system, display control device, and display control method

Even in a case where a pad becomes smaller, solder connection strength is improved. A semiconductor device includes a pad, a diffusion layer, and a melting layer. The pad included by the semiconductor device includes a concave portion on a surface at which solder connection is to be performed. The diffusion layer included by the semiconductor device is disposed at the concave portion and constituted with a metal which remains on the surface of the pad while diffusing into solder upon the solder connection. The melting layer included by the semiconductor device is disposed adjacent to the diffusion layer and constituted with a metal which diffuses and melts into the solder upon the solder connection.

Semiconductor device and manufacturing method of semiconductor device for improving solder connection strength

A medical tool includes: a tool main unit configured to be driven in response to a power supply; a first power supply configured to be removable from the tool main unit; and a second power supply having a smaller power capacity than the first power supply, and configured to be charged by the first power supply. The tool main unit is configured to be driven by receiving power supply from one of the first power supply and the second power supply.

Growing community of inventors

Kanagawa, Japan

Takuya Nakamura