Tokyo Electron Limited

Ricoh Company, Ltd.

Nec Corporation

Fujitsu Corporation

Oki Electric Industry Co., Ltd.

Mobile Tech, Inc.

Takuya Mori

Junki Aoki

Tomohiro Kuroyanagi

Makoto Sasaki

Koichiro Maemura

Fumiyoshi Kittaka

Yukinori Ishii

Tohru Sasaki

Hiroyuki Sakuyama

Atsushi Okazato

Itaru Kodaira

Hiroaki Ikkanzaka

Makoto Hayakawa

Mie Watanabe

Hirohisa Saitoh

Hiroshi Tomita

Hiroto Ohtake

Katsumi Tanaka

Tadashi Nishiyama

Shunsuke Watanabe

Akiko Kiyotomi

Masaki Tasaka

Takashi Toriumi

Yasunori Tsukioka

Yuka Konno

Yoshihiro Hayashi

Tsuyoshi Moriya

Satoru Tanaka

Tadashi Sato

Takehiko Orii

Angelique Denise Raley

Naoki Shimizu

Kunie Ogata

Hiroki Ohno

Kenji Sekiguchi

Masato Hayashi

Noriyuki Kobayashi

Yoshitaka Hara

Masahito Sugiura

Koichiro Inazawa

Keizo Kinoshita

Tatsuo Nishimura

Shoichi Miyamoto

Hideo Shite

Tetsuyuki Shirakawa

Akira Yokoyama

Masaru Amai

Izumi Hasegawa

Michihiro Takahashi

Hiroyuki Izawa

Genki Umeizumi

Yoshitaka Enoki

Ayanori Matsuda

Takayasu Oe

Shin Inoue

Mayumi Kodani

Hayato Aikawa

Tomohiro Nakashima

Tokio Toyama

Hirokazu Sakamoto

Kenta Kikuchi

This method includes, in a substrate treatment system, acquiring an image of a reference substrate which is a reference for condition setting; and acquiring an image of a treated substrate on which the predetermined treatment has been performed under a first treatment condition. A deviation amount in information between the image of the treated substrate and the image of the reference substrate is calculated. A correction amount of the treatment condition is calculated based on a correlation model indicating a correlation between a change amount in the information in the image of the treated substrate and a change amount in the treatment condition and on the deviation amount in the information. Also included is a setting of a second treatment condition based on the correction amount and a performing of the treatment on a target substrate based on the set second treatment condition.

Treatment condition setting method, storage medium, and substrate treatment system

A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.

Connector production method and adhesive film

A device includes a chemical solution flow path in which a chemical solution containing polymers flows; a laser beam irradiator configured to irradiate a laser beam to the chemical solution flow path such that an optical path is intersected with a flow direction of the chemical solution in the chemical solution flow path; a light receiving element provided in the optical path passing through the chemical solution flow path; a detector configured to detect, based on a signal output from the light receiving element, an abnormality in a state of polymers corresponding to a majority of the polymers contained in the chemical solution or configured to detect a ratio between a chemical solution containing the polymers and another chemical solution in the chemical solution flow path.

Abnormality detection device of chemical solution, liquid processing device, substrate processing apparatus, abnormality detection method of chemical solution, liquid processing method, and substrate processing method

A substrate processing apparatus includes a processing unit configured to perform a preset processing on a substrate; a transfer unit, including a holder configured to hold the substrate, configured to carry the substrate into/from the processing unit by displacing the holder which holds the substrate; and a substrate inspection unit configured to acquire, at an outside of the processing unit, information indicating a surface state of the substrate held by the holder.

Substrate processing apparatus and substrate processing method

A contaminant detection system includes a light source configured to emit excitation light on an object to be inspected; a detector configured to detect fluorescence emitted from a contaminant adhering to the object to be inspected; and a processor. The fluorescence is caused by emission of the excitation light from the light source onto the object to be inspected. The processor is configured to perform a determination of a location of the contaminant and a type of the contaminant, based on the fluorescence emitted from the contaminant; and output a result of the determination.

Contaminant detection system, contaminant detecting method, and semiconductor manufacturing apparatus

This method includes a step of imaging, by an imaging apparatus in a substrate treatment system, a reference substrate which is a reference for condition setting and acquiring a captured image of the reference substrate; and a step of imaging, by the imaging apparatus, a treated substrate on which the predetermined treatment has been performed under a current treatment condition and acquiring a captured image of the treated substrate. A deviation amount in color information between the captured image of the treated substrate and the captured image of the reference substrate is calculated. A correction amount of the treatment condition is calculated based on a correlation model acquired in advance and on the deviation amount in the color information. Also included is a step of setting the treatment condition based on the correction amount and performing the treatment on a target substrate based on the set treatment condition.

A method for a substrate processing system includes imaging a substrate before start and after completion of a series of processings on the substrate; specifying a first processing apparatus estimated as having a potential abnormality among a plurality of processing apparatuses; performing a first process on a first inspection substrate under a selected processing condition using the first processing apparatus specified in the specifying, and imaging the first inspection substrate before and after the performing the first process to acquire a first imaging result; performing a second process on a second inspection substrate using a second processing apparatus, and imaging the second inspection substrate for comparison before and after the performing the second process to acquire a second imaging result; and determining whether an actual abnormality exists in the first processing apparatus, based on the first imaging result and the second imaging result.

Method for determining an abnormality and substrate processing system

A substrate inspection method in a substrate treatment system including a plurality of treatment apparatuses each performing a predetermined treatment on a substrate, includes: imaging a surface of a substrate before being treated in the treatment apparatuses to acquire a first substrate image; extracting a predetermined feature amount from the first substrate image; selecting an inspection recipe corresponding to the feature amount extracted from the first substrate image, from a storage unit in which a plurality of inspection recipes each set corresponding to the feature amount in a different range are stored; imaging the surface of the substrate after being treated in the treatment apparatuses to acquire a second substrate image; and determining presence or absence of a defect of the substrate, based on the selected inspection recipe and the second substrate image.

Substrate inspection method, substrate treatment system, and computer storage medium

A substrate warehouse stores a container housing a substrate, and includes a transfer-in part which allows the container to be mounted thereon when the container is transferred-in from an outside; a transfer-out part which allows the container to be mounted thereon when the container is transferred-out to the outside; and a standby part which allows the container standing by for transfer-out to the outside to be mounted thereon. Also included is a functional part including an inspection that performs processing of inspecting the substrate; a delivery part which allows the container to be mounted thereon when delivering the substrate between the functional part and the container; a container transfer mechanism which transfers the container in the substrate warehouse; and a substrate transfer mechanism which transfers the substrate between the functional part and the container mounted on the delivery part.

Substrate warehouse, substrate processing system, and substrate inspection method

A method for correcting a processing condition includes imaging a substrate using an imaging device before start and after completion of a series of processings; specifying a processing apparatus estimated as having an abnormality, based on an imaging result and information on the processing apparatus; performing the unit processing in the processing apparatus on an inspection substrate under a predetermined processing condition, and imaging the inspection substrate by the imaging device before and after performing the unit processing; determining presence/absence of an actual abnormality in the processing apparatus specified in the specifying; and correcting, with respect to the processing apparatus determined as having the actual abnormality in the determining presence/absence of an actual abnormality, the processing condition of the unit processing in the processing apparatus based on the imaging result in the imaging the inspection substrate for determining an abnormality.

Method for correcting processing condition and substrate processing system

A facsimile, a control method, and a non-transitory recording medium. The facsimile designates destination information according to a designation operation by a user, extracts the destination information from an image indicated by image information, determines whether the destination information designated according to the designation operation and the destination information extracted from the image match, and display on a display, a notification screen based on a result of determination.

Facsimile for displaying address confirmation, control method, and non-transitory recording medium

An image forming apparatus are installed with a plurality of applications each for executing at least one of a plurality of functions of the image forming apparatus. The image forming apparatus includes a memory to store first information associating each of the plurality of applications with at least one of the plurality of functions executed by the application. The image forming apparatus further includes circuitry configured to: set, for each of the plurality of functions, restriction information indicating whether or not to restrict use of the function; and control, in a screen including icons each for starting a corresponding one of the plurality of applications, a display state of each of the icons of the applications based on the restriction information set by the circuitry for the function associated with the application by the first information.

Image forming apparatus configured to control display of icons on a screen, information processing method, and non-transitory computer-readable medium

A method of inspecting a substrate to be repeatedly treated along a predetermined transfer way in a plurality of kinds of different treatment apparatuses, includes: imaging a substrate that has been treated in one of the treatment apparatuses, to acquire a first substrate image; imaging a substrate that has been an object for imaging the first substrate image and further treated in another treatment apparatus different from the one treatment apparatus after treated in the one treatment apparatus, to acquire a second substrate image; then performing defect inspection, based on the first substrate image and the second substrate image; and identifying, depending on whether or not a defect detected from the second substrate image is not detected from the first substrate image, whether or not the defect is caused by a treatment after the first substrate image is acquired and a treatment before the second substrate image is acquired.

Substrate inspection method, computer storage medium and substrate inspection apparatus

A method of etching a substrate is described. The method includes disposing a substrate having a surface exposing a first material and a second material in a processing space of a plasma processing system, and performing a modulated plasma etching process to selectively remove the first material at a rate greater than removing the second material. The modulated plasma etching process comprises a power modulation cycle having sequential power application steps that includes: applying a radio frequency (RF) signal to the plasma processing system at a first power level, applying the RF signal to the plasma processing system at a second power level, and applying the RF signal to the plasma processing system at a third power level. Thereafter, the power modulation cycle is repeated at least one more cycle, wherein each modulation cycle includes a modulation time period.

Power modulation for etching high aspect ratio features

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Tokyo, Japan

Takuya Mori