Kioxia Corporation

Toshiba Tec Kabushiki Kaisha

Toshiba Memory Corporation

Takuya Kusaka

Daisuke Arizono

Yasuhiro Shiino

Yoshikazu Harada

Koichi Fukuda

Masato Endo

Hirosuke Narai

Kazunori Masuda

Masanori Hatakeyama

Masato Sugawara

Ryota Hirai

Masatoshi Watarai

Makoto Iwai

A non-volatile memory of an embodiment includes: a memory cell array including a plurality of memory cell transistors; a plurality of word lines connected to a plurality of gates of the plurality of respective memory cell transistors; a VPGM monitor connected to at least one of the plurality of word lines; and a sequencer. When writing voltage is applied to a selected word line selected from among the plurality of word lines at data writing to the memory cell array, the sequencer detects voltage of the selected word line through the VPGM monitor and determines whether detected voltage obtained through the detection has reached a predetermined value.

Semiconductor storage device

A semiconductor device includes first and second chips in a package. A first pad is on the first chip and electrically connected to a node between a power supply pad and a ground pad on the first chip. Second and third pads are on the second chip. An internal wiring connects the first pad to the second pad within the package. A power circuit on the semiconductor chip configured to supply a current to the second pad. A switch is on the second chip between the second pad and the power supply circuit to connect or disconnect the second pad from the power circuit. A control circuit is on the second chip and configured to output a first signal for the switch in response to a test signal supplied to the third pad and a second signal to the power circuit to cause the power circuit to output current.

Semiconductor device and test method of semiconductor device

A semiconductor storage device of an embodiment includes a control circuit configured to execute a writing sequence in which a loop including a program operation that writes data to memory cells and a program verify operation that verifies the data written in the memory cells is repeated a plurality of times by increasing a program voltage by a predetermined step-up voltage each time, the control circuit being capable of executing reading verify that verifies the data written in the memory cells in the writing sequence, and the control circuit detects characteristic variation of a characteristic that causes disturbance, and determines whether to perform the reading verify based on a result of the detection.

According to one embodiment, the insulating layer is provided on the terrace portions. The plurality of contact portions extend through the insulating layer in the stacking direction and contact the terrace portions. The second columnar portion extends through the insulating layer and through the second stacked portion in the stacking direction, and includes a second semiconductor body contacting the first semiconductor region. The first insulating portion divides the first semiconductor region in the first direction. The first insulating portion is provided under a boundary portion between the first stacked portion and the second stacked portion.

Semiconductor device

Growing community of inventors

Kawasaki, Japan

Takuya Kusaka