Murata Manufacturing Co., Ltd.

Takuya Koyanagi

Katsuya Daimon

Hideki Iwamoto

Tetsuya Kimura

Takashi Yamane

Sho Nagatomo

Seiji Kai

Masahiro Fukushima

Daisuke Ajima

Hiromu Okunaga

An acoustic wave device includes a piezoelectric layer and first and second electrodes facing each other in a direction crossing a thickness direction of the piezoelectric layer. The acoustic wave device utilizes a bulk wave of a thickness slip first-order mode. The acoustic wave device includes first and second resonators. Each of the first and second resonators includes the first and second electrodes, and a setting portion including a setup region where the first and second electrodes are provided in the piezoelectric layer. The thickness of each of the first and second resonators excludes the thickness of the first and second electrodes included in the resonator. The thickness of the first resonator is different from the thickness of the second resonator.

Acoustic wave device

An acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode on the piezoelectric substrate, and reflectors. The interdigital transducer electrode includes first and second busbars including first and second cavities in a first direction, and first and second edge regions and first and second gap regions. The first and second edge regions include low acoustic velocity regions. Regions in which the first and second cavities are provided include high acoustic velocity regions. The reflector includes first and second reflector busbars and first reflection electrode fingers each including a second end portion that faces the second reflector busbar. The first reflection electrode fingers overlap the entire or substantially the entire second gap region when viewed in the first direction.

An acoustic wave device includes a support substrate and first and second resonant sections adjacent to each other on the support substrate. Each of the first and second resonant sections includes a piezoelectric thin film, an IDT electrode on the piezoelectric thin film, and a support layer surrounding the piezoelectric thin film in a plan view of the acoustic wave device. The support layer has a different linear expansion coefficient from the piezoelectric thin film. The piezoelectric thin film in the first resonant section and the piezoelectric thin film in the second resonant section are divided by the support layer between the resonant section and the resonant section.

An acoustic wave device includes a silicon oxide film, a piezoelectric body, and an interdigital transducer electrode laminated on a support substrate made of silicon. Where a wave length that is determined by an electrode finger pitch of the interdigital transducer electrode is &#x3bb;, a thickness of the support substrate is greater than or equal to about 3&#x3bb;. An acoustic velocity of the first higher mode that propagates through the piezoelectric body is an acoustic velocity V=(V)of bulk waves that propagate in the support substrate, which is determined by Vout of solutions V, V, and Vof x derived from the mathematical expression Ax+Bx+Cx+D=0, or higher than V.

Acoustic wave device, acoustic wave device package, radio-frequency front-end circuit, and communication device

An electronic component includes a support member, a piezoelectric film, and an interdigital transducer. The support member includes silicon as a primary component. The piezoelectric film is provided directly or indirectly on the support member. The interdigital transducer includes a plurality of electrode fingers. The plurality of electrode fingers are provided side by side separately from each other. The interdigital transducer is provided on the principal surface of the piezoelectric film. The film thickness of the piezoelectric film is about 3.5 &#x3bb; or less, where &#x3bb; denotes the wavelength of an acoustic wave determined by the electrode finger pitch of the interdigital transducer. In the support member, the high-impurity-concentration region is further from the piezoelectric film than the low-impurity-concentration region.

Electronic component

An acoustic wave device including series arm resonators including a first IDT electrode and parallel arm resonators including a second IDT electrode, in the first IDT electrode, a first envelope obliquely extends with respect to the acoustic wave propagation direction, and a second envelope obliquely extends with respect to the acoustic wave propagation direction, the second IDT electrode includes a central region, a first low acoustic velocity region in which an acoustic velocity is lower than an acoustic velocity in the central region, a second low acoustic velocity region in which an acoustic velocity is lower than the acoustic velocity in the central region, a first high acoustic velocity region in which an acoustic velocity is higher than the acoustic velocity in the central region, and a second high acoustic velocity region in which an acoustic velocity is higher than the acoustic velocity in the central region.

An elastic wave device includes a multilayer film stacked on a support substrate. A first support layer surrounds a region including interdigital transducer electrodes. A second support layer is disposed in the region surrounded by the first support layer. A cover is fixed on the first support layer and the second support layer so as to close a cavity defined by the first support layer. The multilayer film is partially disposed on the support substrate, and an insulating layer is disposed in at least a portion of a region in which the multilayer film is not disposed. At least one of the first support layer and the second support layer is disposed on the insulating layer.

Elastic wave device

An elastic wave device includes an IDT electrode on a piezoelectric substrate to define a longitudinally coupled resonator elastic wave filter, a three-dimensional wiring portion on the piezoelectric substrate and connected to the longitudinally coupled resonator elastic wave filter, and a cover surrounding the longitudinally coupled resonator elastic wave filter on the piezoelectric substrate. The three-dimensional wiring portion includes a lower layer wiring line, an upper layer wiring line, and an insulating layer stacked between the lower layer wiring line and the upper layer wiring line. The cover includes a portion on the three-dimensional wiring portion.

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Nagaokakyo, Japan

Takuya Koyanagi