Denso Corporation

Nippondenso Co., Ltd.

Research Development Corporation of Japan

Takuya Kouya

Kazuma Natsume

Yoshiki Ueno

Asahi Kondo

Yuu Watanabe

Masanobu Yukumatsu

Kento Nakabayashi

Kouichi Hoshino

A high-frequency module includes a substrate, an integrated circuit mounted to the substrate, a cylindrical shield enclosing the integrated circuit to block radio waves, a casing provided on an opposite side of the substrate relative to the shield to block radio waves, and a choke portion provided in an inner wall of the casing, the inner wall being opposed to the shield, or provided in the substrate, with a predetermined gap being formed relative to the shield, to create an antiphase in radio waves having a predetermined frequency emitted from the integrated circuit into a space above the substrate.

High-frequency module

The array antenna includes a feed line, and a plurality of radiating element sections arranged at a predetermined arranging interval in a first direction, each of the radiating element sections including at least one radiating element fed a traveling wave through the feed line. The inter-element line length as a length of the feed line between each succeeding two of the radiating element sections is longer than the arranging interval in the first direction.

Array antenna and radar apparatus

An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on the insulating member. The wiring pattern includes an electrode part to which the integrated circuit bare chip is electrically coupled. The insulating member includes an under region being opposite to the electrode part. The metal base includes a metal substrate and a metal portion protruding from the metal substrate. The metal portion is buried in the under region of the insulating member.

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

A first semiconductor layer and a second semiconductor layer are laminated on a semiconductor wafer in that order. A resist pattern having an opening is formed on the second semiconductor layer. The second semiconductor layer is etched through the opening in the formed resist pattern to expose the first semiconductor layer. A surface oxide film is formed on the exposed surface of the first semiconductor layer and then selectively etched away. Alternatively, the exposed surface of the first semiconductor layer is subjected to a separate oxidization treatment and the resulting surface oxide film is selectively removed in the subsequent etching.

Growing community of inventors

Nagoya, Japan

Takuya Kouya