Kabushiki Kaisha Toshiba

Canon Kabushiki Kaisha

Canon Nanotechnologies, Inc.

Takuya Kono

Ikuo Yoneda

Masayuki Hatano

Kazuya Fukuhara

Yutaka Watanabe

Tatsuhiko Higashiki

Keiji Yamashita

Yasutada Nakagawa

Shoichi Harakawa

Shinichi Ito

Takashi Sato

Takashi Sakamoto

Hiroshi Nomura

Ryoichi Inanami

Masato Suzuki

Nobuhiro Komine

Kentaro Matsunaga

Manabu Takakuwa

Daisuke Kawamura

Shinji Mikami

Junichiro Iba

Hiroyuki Morinaga

Makiko Katano

Arata Inoue

Makoto Ikeda

Ayako Mizuno

Takema Ito

Makato Ikeda

Provided is an imprint apparatus that applies a resin (drops) dispersed at a plurality of locations on a substrate, brings the resin and a mold into contact, and transfers the contoured pattern that is formed in the mold to the resin comprising: a controller that sets a principal axis direction according to the contoured pattern and an array direction in which a plurality of resin drops are aligned, and determines application positions for the resin such that the array direction is angled with respect to the principal axis direction; and a dispenser that applies the resin based on the application positions that have been determined.

Imprint apparatus, imprint method, and article manufacturing method

Provided is an imprint apparatus that applies a resin to several locations on a substrate, brings the resin and a mold into contact, and transfers a contoured pattern formed in the mold to the resin, comprising: a controller that sets a principal axis direction according to the contoured pattern and determines the application positions of the resin based on the principal axis direction that has been set such that the distances between resin drops that have been applied so as to be separated in the principal axis direction is larger than the distances between resin drops that have been applied so as to be separated in a direction that is perpendicular to the principal axis direction; and a dispenser that applies the resin based on the application position that has been determined.

According to one embodiment, an imprint method comprises coating a photo-curable organic material on a film to be processed, bringing a concave-convex pattern of a template into contact with the photo-curable organic material, applying a force to the template in such a state that the template is brought into contact with the photo-curable organic material, curing the photo-curable organic material by irradiating light onto the photo-curable organic material, in such a state that the template is brought into contact with the photo-curable organic material, and releasing the template from the photo-curable organic material after the light irradiation. The force applied to the template corresponds to a gap between a surface of the film to be processed and the template.

Imprint method and imprint system

According to one embodiment, a fine processing method includes determining a resist amount required for each first region of a pattern formation surface and a total amount of resist. The method include dividing the total amount of resist by a volume of one resist drop to determine the resist drops total number. The method include determining a provisional position for the resist drop of the total number. The method include assigning the each first region to nearest one resist drop, and partitioning again the pattern formation surface into second regions assigned to the each resist drop. The method include determining a divided value by dividing the volume of the one resist drop by the required total amount of resist determined. The method include finalizing a final position of the each resist drop, if a distribution of the divided value in the pattern formation surface falls within a target range.

Fine processing method, fine processing apparatus, and recording medium with fine processing program recorded thereon

A template formed of an optically-transparent material according to an embodiment includes a contact surface which contacts a resist material, a concave portion for resist pattern formed on the contact surface in which the resist material is filled and cured so as to form a resist pattern part, and a concave portion for alignment mark formed on the contact surface which is used for an optical alignment of the template, includes an opening and a bottom portion and has a shape that an area of the opening is larger than that of the bottom portion or a shape that a depth thereof is deeper than that of the concave portion for resist pattern.

Template and method of manufacturing a semiconductor device

An immersion lithography apparatus includes: a projection optical system which projects a pattern of a mask onto a substrate; a substrate cleaning unit which cleans the substrate prior to projection of the pattern; a liquid supply mechanism which supplies the same liquid to an immersion region between the projection optical system and the substrate and to the substrate cleaning unit; a first liquid discharge path through which the liquid discharged from the immersion region is passed; and a second liquid discharge path through which the liquid discharged from the substrate cleaning unit is passed.

Immersion lithography apparatus and exposure method

An immersion exposure apparatus includes a placement unit on which a substrate is to be placed, the substrate including a body to be processed and a resist film on the body, a projection optical system including a projection lens, a liquid supply unit including an immersion nozzle, a measurement unit for measuring positions of alignment marks Mi (i=1, 2, . . . ) on the substrate, and a control unit for controlling a position of the placement unit on which the substrate is placed so that a pattern image of the photo mask is projected onto a predetermined position on the substrate when immersion exposure to the substrate is performed based on a measurement value acquired by the measurement unit and a correction value for correcting a measurement error resulting from a change of a measurement environment caused during measurement of alignment marks Mi.

Immersion exposure apparatus and method of manufacturing a semiconductor device

There is provided a surface position measuring system which includes a reflectivity computing module which computes predictive reflectivities of a plurality of circuit patterns, an inspection light source which irradiates an inspection light onto each of a plurality of inspection areas, area by area, above the plurality of circuit patterns under irradiation conditions determined based on a corresponding each of the predictive reflectivities of the plurality of circuit patterns, and a photodetector which detects a reflected inspection light reflected from each of the plurality of inspection areas to detect a surface position of a corresponding each of the plurality of inspection areas.

Surface position measuring system, exposure method and semiconductor device manufacturing method

This invention discloses an immersion exposure method which executes immersion exposure for an exposure target film by transferring an image of a pattern formed on a mask onto the exposure target film through an immersion medium. A first vapor pressure as the target value in an immersion exposure atmosphere which surrounds the immersion medium is set. A second vapor pressure in the immersion exposure atmosphere is measured. The first vapor pressure is compared with the second vapor pressure. Whether to adjust the vapor pressure in the immersion exposure atmosphere is selected in accordance with the comparison result.

Immersion exposure method and immersion exposure apparatus which transfer image of pattern formed on mask onto substrate through immersion medium

An exposure processing system comprises an exposure apparatus to expose a resist on a wafer, a heating apparatus comprising heating apparatus units, the heating apparatus heating the exposed resist by a heating apparatus unit in the heating apparatus units, a developing apparatus comprising developing apparatus units, the developing apparatus developing the exposed and heated resist by a developing apparatus unit in the developing apparatus units, and a control apparatus to control the exposure apparatus by using correction data so that a wafer on process object being exposed, the correction data being data for correcting a dimensional dispersion of a resist pattern caused by a pair of heating apparatus unit and developing apparatus unit used for the wafer on the process object, the pair of heating and developing apparatus unit comprising a heating and developing apparatus unit in the heating and developing apparatus used for the wafer on the process object.

Exposure processing system, exposure processing method and method for manufacturing a semiconductor device

A system for controlling an overlay includes a processing data receiving module receiving a processing data string describing a name of an exposure process for a target layer and an original control set value of overlays between the target layer and underlying layers below the target layer; an inspection data receiving module receiving inspection data strings describing names of inspection processes and inspection values determined by the inspection processes inspecting respective overlays between the target layer and the underlying layers; a data combining module combining the processing data string and each of the inspection data strings using a combining condition table so as to create a correction data table; and a control set value calculation module calculating a corrected control set value based on the inspection values of the correction data table.

System for controlling an overlay, method for controlling overlay, and method for manufacturing a semiconductor device

There is disclosed an immersion exposure method of carrying out an exposure process in a state that liquid is at least partly filled between a substrate to be exposed and a projection optical system of an exposure apparatus carrying out the exposure process, comprising carrying out a process of making large a contact angle to the liquid with at least outer peripheral portion of a main surface of the substrate compared with a contact angle to the liquid with an area adjacent to the outer peripheral portion of the substrate, which area is a part of a surface of a substrate supporting side of a substrate support member supporting the substrate included in the exposure apparatus, and carrying out the exposure process.

Immersion exposure method and apparatus, and manufacturing method of a semiconductor device

A system for making a recipe for each of manufacturing tools used to manufacture products includes a merging unit merging product information for the products and process information for each of manufacturing processes used for the products to make intermediate recipe data, and a making unit making the recipe for each of the manufacturing tools by merging information of the intermediate recipe data and information of a basic recipe including information of parameters, which specify operations of the manufacturing tools and are commonly set in the manufacturing processes.

System and program for making recipe and method for manufacturing products by using recipe

An exposure system includes, (a) an exposure apparatus, and (b) a displacement correction apparatus having a curvature information storage unit configured to store curvature information of a reticle; a displacement information calculation unit configured to calculate displacement generated in the reticle being fixed on a reticle stage of an exposure apparatus based on the curvature information; and a correction information calculation unit configured to calculate correction information for correcting a projection lens of the exposure apparatus based on the displacement.

Growing community of inventors

Yokosuka, Japan

Takuya Kono