E.i. Dupont De Nemours and Company

Zuken, Inc.

Takuya Konno

Richard John Sheffield Young

Hideki Akimoto

Hisashi Matsuno

Jerome David Smith

Michael Rose

Giovanna Laudisio

Patricia J Ollivier

Brian J Laughlin

Takashi Kitagaki

Takayuki Kaneda

Hiroki Kojo

Keiichiro Hayakawa

Naoto Nakajima

Yoshikuni Shibata

Norihiko Takeda

The present invention relates to a conductive paste for bonding that comprises a metal powder and a solvent, wherein the metal powder comprises a first metal powder having a particle diameter (D50) of 10 to 150 nm and a second metal powder having a particle diameter (D50) of 151 to 500 nm. The paste is useful for manufacturing an electronic device comprising a substrate with an electrically conductive layer and an electrical or electronic component, which are reliably bonded together using the paste.

Conductive paste for bonding

An input information processing system, which is configured so as to enable an operator to efficiently conduct work without interruption, and processes input information that has been inputted using an input device, is configured so as to comprise: a display means for displaying data to be processed on a display screen; a first input device for inputting first input information; a second input device for inputting second input information; an acquisition means for acquiring a predetermined position in the data to be processed, which is displayed on the display screen of the display means, on the basis of the first input information inputted using the first input device; and control means for clearly showing the predetermined position in the data to be processed which was acquired by the acquisition means on the data to be processed displayed on the display screen of the display means, and for controlling the data to be processed which is displayed on the display screen of the display means on the basis of the second input information inputted using the second input device.

Input information processing system, input information processing method, program and computer-readable recording medium

A heat-curable polymer paste comprising: (i) 100 parts by weight of a transparent polyester resin having a hydroxyl value of 1 to 10 mgKOH/g and a glass transition point (Tg) of 40 to 120&#xb0; C., (ii) 1 to 30 parts by weight of a crosslinking agent comprising methoxymethyl imino melamine represented as formula (I); (CN)[&#x2014;N(H)(CHOCH)][&#x2014;N(CHOCH)](I) wherein n is 1 to 3, and (iii) 50 to 200 parts by weight of an organic solvent.

Heat-curable polymer paste

Embodiments of the invention relate to a silicon semiconductor device, and a conductive paste for use in the front side of a solar cell device.

Conductive compositions and processes for use in the manufacture of semiconductor devices&#x2014;organic medium components

The present invention pertains to an electroconductive paste for a solar cell electrode, which includes a first silver powder with a crystallite size of 58 nm, a second silver powder with a different crystallite size from that of the first silver powder, glass frit, and resin binder. The present invention also provides a solar cell having an electrode containing the aforementioned electroconductive paste.

Paste for solar cell electrode, solar cell electrode manufacturing method, and solar cell

An objective of this present invention is to provide a conductive paste that could obtain good electrical property, for example series resistance in an electrode. An aspect of the present invention relates to a conductive paste which comprises electrically conductive powder; glass frit which comprises, based on weight percent (wt %) of the glass frit, 8-26 wt % of SiO, 0.1-5 wt % of AlO, and 73-90 wt % of lead compound, wherein lead fluoride is contained in the range of 5-28 wt % based on the total weight of the lead compound; and organic medium.

Glass compositions used in conductors for photovoltaic cells

A method of manufacturing a solar cell electrode comprising steps of: applying onto a semiconductor substrate a conductive paste comprising (i) a conductive powder, (ii) a glass frit, (iii) an organic polymer and (iv) an organic solvent comprising 30 to 85 weight percent (wt %) of 1-phenoxy-2-propanol based on the weight of the organic solvent; and firing the conductive paste.

Method of manufacturing solar cell electrode and conductive paste

To obtain low resistance and high adhesion at the same time in a solar cell electrode, a conductive paste is offered. A conductive paste for solar cell electrode contains conductive powder, organic medium and glass frit which is mixture of more than one kind of glass frit such as a mixture of glass frit containing at least PbO and glass frit containing at least Bi2O3.

Conductive paste for solar cell electrode

An electrode paste for a solar cell comprising electrically conductive particles, lead-free glass frit, a resin binder and zinc oxide particles, wherein zinc oxide particles having a specific surface area of 6 m/g or less are contained at 10% by weight or more based on the total amount of zinc oxide.

Electrode paste for solar cell and solar cell electrode using the paste

The invention relates to glass compositions useful in conductive pastes for silicon semiconductor devices and photovoltaic cells. The thick film conductor compositions include one or more electrically functional powders and one or more glass frits dispersed in an organic medium. The thick film compositions may also include one or more additive(s). Exemplary additives may include metals, metal oxides or any compounds that can generate these metal oxides during firing.

Disclosed is an electrically conducting paste comprising a silver powder, a glass frit, a resin binder and a sintering inhibitor. The paste is used in the manufacture of solar cell electrodes by applying the electrically conducting paste to a substrate and then firing of the coated substrate.

Paste for solar cell electrodes, method for the manufacture of solar cell electrodes, and the solar cell

In a paste for a solar cell light-receiving surface electrode including silver particles, glass frit, resin binder, and thinner, silver particles with a specific surface of 0.20-0.60 m/g are used as the silver particles. The silver particles are preferably included at 80 mass % or more to the total amount of silver particles being included in the paste.

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Tochigi-ken, Japan

Takuya Konno