Denso Corporation

Takuya Isomura

Takanori Kawashima

Hitoshi Ozaki

A semiconductor device may be provided with a first semiconductor element including a plurality of signal electrodes, a second semiconductor element including a plurality of signal electrodes, an encapsulant encapsulating the first semiconductor element and the second semiconductor element, and a plurality of signal terminals protruding from the encapsulant. The plurality of signal terminals may include a first signal terminal, a second signal terminal and a common signal terminal. The first signal terminal may be connected with one of the signal electrodes of the first semiconductor element within the encapsulant. The second signal terminal may be connected with one of the signal electrodes of the second semiconductor element within the encapsulant. The common signal terminal may be, within the encapsulant, connected with another one of the signal electrodes of the first semiconductor element and another one of the signal electrodes of the second semiconductor element.

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Aichi-gun, Japan

Takuya Isomura